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73K224BL-IH/F

Description
Single-Chip Modem w/ Integrated Hybrid
CategoryWireless rf/communication    Telecom circuit   
File Size204KB,33 Pages
ManufacturerTeridian Semiconductor Corporation
Websitehttp://www.teridian.com/
Download Datasheet Parametric Compare View All

73K224BL-IH/F Overview

Single-Chip Modem w/ Integrated Hybrid

73K224BL-IH/F Parametric

Parameter NameAttribute value
MakerTeridian Semiconductor Corporation
package instructionLEAD FREE, PLASTIC, LCC-32
Reach Compliance Codeunknow
data rate2.4 Mbps
JESD-30 codeR-PQCC-J32
length13.995 mm
Number of functions1
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeRECTANGULAR
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height3.56 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width11.455 mm
73K224BL
V.22bis, V.22, V.21, Bell 212A, 103
Single-Chip Modem w/ Integrated
Hybrid
Simplifying System Integration™
DATA SHEET
DESCRIPTION
The 73K224BL is a highly integrated single-chip
modem IC which provides the functions needed to
construct a V.22bis compatible modem, capable of
2400 bit/s full-duplex operation over dial-up lines. The
73K224BL is an enhancement of the 73K224L single-
chip modem, which adds the hybrid hook switch
control, and driver to the 73K224L. The 73K224BL
integrates analog, digital, and switched-capacitor
array functions on a single chip, offering excellent
performance and a high level of functional integration
in a 32-Lead PLCC package.
The 73K224BL operates from a single +5 V supply for
low power consumption.
The 73K224BL is designed to appear to the systems
designer as a microprocessor peripheral, and will
easily interface with popular single-chip micro-
processors (80C51 typical) for control of modem
functions through its 8-bit multiplexed address/data
bus or via an optional serial control bus. An ALE
control simplifies address demultiplexing. Data
communications normally occur through a separate
serial port.
(continued)
FEATURES
Includes features of 73K224L single-chip
modem
On chip 2-wire/4-wire hybrid driver and off
hook relay buffer driver
One-chip multi-mode V.22bis/V.22/V.21 and
Bell 212A/103 compatible modem data pump
FSK (300 bit/s), DPSK (600, 1200 bit/s), or
QAM (2400 bit/s) encoding
Software compatible with other TERIDIAN
Semiconductor K-Series one-chip modems
Interfaces directly with standard
processors (80C51 typical)
Parallel or serial bus for control
Selectable
internal
buffer/debuffer
scrambler/descrambler functions
and
micro-
All asynchronous and synchronous operating
modes (internal, external, slave)
(continued)
BLOCK DIAGRAM
DTMF,
ANSWER,
GUARD &
CALLING
TONE
GENERATOR
FSK
MODULATOR
OH
BUFFER
SCRAMBLER
DI-BIT/
QUAD-BIT
ENCODER
8-BIT
µP
BUS
INTERFACE
FIR
PULSE
SHAPER
QAM/
DPSK
MODULATOR
FILTER
EQUALIZER
FILTER
ATTENUATOR
TXA1
2W/4W
HYBRID
DI-BIT/
QUAD-BIT
DECODER
DIGITAL
SIGNAL
PROCESSOR
RECEIVE
FUNCTIONS
FILTER
TXA2
RXA
DEBUFFER
DESCRAMBLER
A/D
EQUALIZER
FILTER
FILTER
FIXED
DEMODULATOR
AGC
TXD
RXD
SERIAL
INTERFACE
GAIN
BOOST
TONE
DETECTION
Page: 1 of 33
©
2005, 2008 TERIDIAN Semiconductor Corporation
Rev 7.1

73K224BL-IH/F Related Products

73K224BL-IH/F 73K224BL 73K224BL-IHR/F
Description Single-Chip Modem w/ Integrated Hybrid Single-Chip Modem w/ Integrated Hybrid Single-Chip Modem w/ Integrated Hybrid
Maker Teridian Semiconductor Corporation - Teridian Semiconductor Corporation
package instruction LEAD FREE, PLASTIC, LCC-32 - LEAD FREE, PLASTIC, LCC-32
Reach Compliance Code unknow - unknow
data rate 2.4 Mbps - 2.4 Mbps
JESD-30 code R-PQCC-J32 - R-PQCC-J32
length 13.995 mm - 13.995 mm
Number of functions 1 - 1
Number of terminals 32 - 32
Maximum operating temperature 85 °C - 85 °C
Minimum operating temperature -40 °C - -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code QCCJ - QCCJ
Package shape RECTANGULAR - RECTANGULAR
Package form CHIP CARRIER - CHIP CARRIER
Certification status Not Qualified - Not Qualified
Maximum seat height 3.56 mm - 3.56 mm
Nominal supply voltage 5 V - 5 V
surface mount YES - YES
technology CMOS - CMOS
Telecom integrated circuit types MODEM - MODEM
Temperature level INDUSTRIAL - INDUSTRIAL
Terminal form J BEND - J BEND
Terminal pitch 1.27 mm - 1.27 mm
Terminal location QUAD - QUAD
width 11.455 mm - 11.455 mm
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