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WF1M32B-120HI3A

Description
Flash Module, 1MX32, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size481KB,13 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WF1M32B-120HI3A Overview

Flash Module, 1MX32, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WF1M32B-120HI3A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codePGA
package instructionPGA,
Contacts66
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time120 ns
Other featuresUSER CONFIGURABLE 1M X 32; 1000000 ERASE/PROGRAM CYCLES; MINIMUM 20 YEARS DATA RETENTION
startup blockBOTTOM
Data retention time - minimum20
JESD-30 codeS-CPGA-P66
length30.1 mm
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage3.3 V
Certification statusNot Qualified
Maximum seat height6.22 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width30.1 mm
Base Number Matches1
White Electronic Designs
1Mx32 3.3V Flash Module
FEATURES
Access Times of 100, 120, 150ns
Packaging
• 66 pin, PGA Type, 1.185" square, Hermetic
Ceramic HIP (Package 401)
• 68 lead, Low Profile CQFP (G2T), 4.6mm
(0.180") square (Package 509)
1,000,000 Erase/Program Cycles
Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and
fifteen 64kBytes in byte mode
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
Organized as 1Mx32
Commercial, Industrial and Military Temperature
Ranges
3.3 Volt for Read and Write Operations
WF1M32B-XXX3
Boot Code Sector Architecture (Bottom)
Low Power CMOS, 1.0mA Standby
Embedded Erase and Program Algorithms
Built-in Decoupling Caps for Low Noise Operation
Erase Suspend/Resume
• Supports reading data from or programing data to
a sector not being erased
Low Current Consumption
Typical values at 5MHz:
• 40mA Active Read Current
• 80mA Program/Erase Current
Weight
WF1M32B-XG2TX3 -8 grams typical
WF1M32B-XHX3 -13 grams typical
Note: For programming information refer to Flash Programming 8M3 Application Note.
PIN CONFIGURATION FOR WF1M32B-XHX3
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
RESET#
Pin Description
I/O0-31
A0-19
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Selects
Output Enable
Reset
Power Supply
Ground
Not Connected
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE#
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
34
V
CC
CS
4
#
NC
I/O
27
A
4
A
5
A
6
NC
CS
3
#
GND
I/O
19
44
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
56
WE#
CS1-4#
OE#
RESET#
V
CC
GND
NC
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
A
19
I/O
3
Block Diagram
CS1#
RESET#
WE#
OE#
A0-19
1M x 8
1M x 8
CS2#
CS3#
CS4#
1M x 8
1M x 8
I/O
20
55
66
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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