HY62UF16201LLM-12I datasheet, PDF

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HY62UF16201LLM-12I: DescriptionStandard SRAM, 128KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48; Categorystorage storage; File Size136KB，9 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY62UF16201LLM-12I Overview

Standard SRAM, 128KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48

HY62UF16201LLM-12I Parametric

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	120 ns
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	9.25 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	0.95 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6.7 mm
Base Number Matches	1

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HY62UF16201 Series

128Kx16bit full CMOS SRAM

PRELIMINARY

DESCRIPTION

The HY62UF16201 is a high speed, low power

and 2M bit full CMOS SRAM organized as

131,072 words by 16bit. The HY62UF16201 uses

high performance full CMOS process technology

and designed for high speed low power circuit

technology. It is particularly well suited for used in

high density low power system application. This

device has a data retention mode that guarantees

data to remain valid at a minimum power supply

voltage of 1.5V.

FEATURES

•

Fully static operation and Tri-state output

•

TTL compatible inputs and outputs

•

Battery backup(LL-part)

- 1.5V(min) data retention

•

Standard pin configuration

- 48ball uBGA

Product

Voltage

Speed

Operation

Standby Current(uA)

No.

(V)

(ns)

Current(mA)

LL-part

HY62UF16201

3.0

85/100/120

HY62UF16201-I

3.0

85/100/120

Note 1. E.T. : Extended Temperature, Normal : Normal Temperature

2. Current value is max.

Temperature

(°C)

0~70(Normal)

-40~85(E.T.)

PIN CONNECTION

( Top View )

ADD INPUT

BUFFER

A1,A2

A4, A6~A7

BLOCK DIAGRAM

ROW

DECODER

/LB

/OE A0

A12

A15~A16

A10

PRE-DECODER

COLUMN

DECODER

IO9 /UB A3

IO10 IO11 A5

Vss IO12 NC

Vcc IO13 NC

/CS IO1

IO2 IO3

IO4 Vcc

SENSE AMP

I/O1

ADD INPUT

BUFFER

A13

A14

ADD INPUT

BUFFER

A16 IO5 Vss

BLOCK

DECODER

MEMORY ARRAY

512x128x32

WRITE DRIVER

OUTPUT

BUFFER

I/O8

I/O9

IO15 IO14 A14 A15 IO6 IO7

IO16 NC

A12 A13 /WE IO8

A10 A11 NC

I/O16

A11

/CS

/OE

/LB

/UB

/WE

PIN DESCRIPTION

Pin Name

/CS

/WE

/OE

/LB

/UB

Pin Funtion

Chip Select

Write Enable

Output Enable

Lower Byte Control(I/O1~I/O8)

Upper Byte Control(I/O9~I/O16)

Pin Name

I/O1~I/O16

A0~A16

Vcc

Vss

Pin Funtion

Data Input/Output

Address Input

Power(2.7V ~ 3.3V)

Ground

No Connection

This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any

responsibility for use of circuits described. No patent licenses are implied.

Rev.03 /Mar.99

Hyundai Semiconductor

HY62UF16201LLM-12I Related Products

	HY62UF16201LLM-12I	HY62UF16201LLM-12	2907682	HY62UF16201LLM-85	HY62UF16201LLM-85I	HY62UF16201LLM-10
Description	Standard SRAM, 128KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 128KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48	Thermal magnetic UL 489 miniature circuit breakers	Standard SRAM, 128KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 128KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48
Maker	SK Hynix	SK Hynix	-	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	BGA	BGA	-	BGA	BGA	BGA
package instruction	VFBGA,	VFBGA,	-	VFBGA,	VFBGA,	VFBGA,
Contacts	48	48	-	48	48	48
Reach Compliance Code	unknown	unknown	-	unknown	unknown	compli
ECCN code	3A991.B.2.A	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	120 ns	120 ns	-	85 ns	85 ns	100 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48	-	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e1	e1	-	e1	e1	-
length	9.25 mm	9.25 mm	-	9.25 mm	9.25 mm	9.25 mm
memory density	2097152 bit	2097152 bit	-	2097152 bit	2097152 bit	2097152 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	-	16	16	16
Number of functions	1	1	-	1	1	1
Number of terminals	48	48	-	48	48	48
word count	131072 words	131072 words	-	131072 words	131072 words	131072 words
character code	128000	128000	-	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	-	70 °C	85 °C	70 °C
organize	128KX16	128KX16	-	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	-	VFBGA	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.95 mm	0.95 mm	-	0.95 mm	0.95 mm	0.95 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	-	3 V	3 V	3 V
surface mount	YES	YES	-	YES	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	-	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	-
Terminal form	BALL	BALL	-	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	-	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM
width	6.7 mm	6.7 mm	-	6.7 mm	6.7 mm	6.7 mm

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