MS16083R3ML datasheet, PDF - EEWORLD Datasheet

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MS16083R3ML: DescriptionMULTILAYER CHIP INDUCTOR; File Size185KB，6 Pages; ManufacturerABC [ABC Taiwan Electronics Corp]

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MS16083R3ML Overview

MULTILAYER CHIP INDUCTOR

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SPECIFICATION FOR APPROVAL

REF :

PROD.

NAME

PAGE: 1

MULTILAYER CHIP INDUCTOR

ABC'S DWG NO.

ABC'S ITEM NO.

MS1608□□□□L□-□□□

Ⅰ﹒CONFIGURATION

& DIMENSIONS：

(PCB Pattern)

Unit : m/m

0.30±0.20

0.7

Series

MS1608

1.60±0.20

0.80±0.20

Ⅱ﹒SCHEMATIC

DIAGRAM：

Ⅲ﹒MATERIALS：

a﹒Body：Ferrite

b﹒Internal conductor：Silver or Ag / Pd

c﹒Terminal：Cu/Sn

d﹒Remark：Products comply with RoHS' requirements

Ⅳ﹒GENERAL

SPECIFICATION：

a﹒Storage temp.：-40℃ ---- +105℃

b﹒Operating temp.：-25℃ ---- +85℃

c﹒Terminal strngth：

Type

MS1608

d﹒Solderability：

Solder : Sn96.5 / Ag3 / Cu0.5

or equivalent

Solder temp. : 260±5℃

Flux : Rosin

Dip time : 4±1 seconds

AR-001A

F ( kgf )

0.5

time ( sec )

30±5

Temperature (

℃

)

250

50s ec max.

Peak Temp：260℃ max.

Max time above 230℃

：50sec

max.

Max time above 200℃

：70sec

max.

Temperature

Rising Area

+4.0

℃

/ sec max.

Preheat Area

150 ~ 200

℃

/ 60 ~ 120sec

Reflow Area

+2.0 ~ 4.0

℃

/ sec max.

Forced Cooling Area

-(1.0 ~ 5.0)

℃

/ sec max.

Peak Temperature:

260

℃

230

℃

200

150

70sec max.

100

150

Time ( seconds )

200

250

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