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MS2029R56ML

Description
MULTILAYER CHIP INDUCTOR
File Size181KB,6 Pages
ManufacturerABC [ABC Taiwan Electronics Corp]
Download Datasheet View All

MS2029R56ML Overview

MULTILAYER CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF :
20090811-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 1
MS20□□□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒
CONFIGURATION & DIMENSIONS
A
D
D
H
C
I
B
G
( PCB Pattern )
Unit : m/m
C
0.90±0.20
1.20±0.20
D
0.50±0.30
0.50±0.30
G
1.0
1.0
H
1.0
1.0
I
1.0
1.0
I
Series
MS2029
MS2022
A
2.00±0.20
2.00±0.20
B
1.20±0.20
1.20±0.20
Ⅱ﹒
SCHEMATIC DIAGRAM
Ⅲ﹒
MATERIALS
a
Body
Ferrite
b
Internal conductor
Silver or Ag / Pd
c
Terminal
Cu/Sn
d
Remark
Products comply with RoHS' requirements
a
b
c
Ⅳ﹒
GENERAL SPECIFICATION
a
Storage temp.
-40 ---- +105
b
Operating temp.
-55 ---- +125
c
Terminal Strength
F
Type
MS2022
MS2029
F ( kgf )
0.8
0.6
time ( sec )
30±5
Temperature (
)
250
50sec max.
Peak Temp
260
max.
Max time above 230
℃ :
50sec max.
Max time above 200
℃ :
70sec max.
Temperature
Rising Area
+4.0
/ sec max.
Preheat Area
150 ~ 200
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
/ sec max.
Peak Temperature:
260
230
200
150
70sec max.
d
Solderability
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
100
50
0
50
100
150
Time ( seconds )
200
250
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