SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MS3261□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
D
D
C
I
B
G
I
( PCB Pattern )
Unit : m/m
C
D
0.60±0.40
G
2.2
H
1.4
I
1.1
Series
MS3261
A
3.20±0.20
B
1.60±0.20
1.10±0.20
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Cu/Sn
d﹒Remark：Products comply with RoHS' requirements
a
b
H
c
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-40℃---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal storength：
F
Type
MS3261
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
F ( kgf )
1.0
time ( sec )
30±5
Temperature (
℃
)
250
50sec max.
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperatu re
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Coo ling Area
-(1 .0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
230
℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 2
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MS3261□□□□L□-□□□
Ⅴ﹒ELECTRICAL
CHARACTERISTICS
：
DWG No.
MS326147NML□ -□□□
MS326168NML□ -□□□
MS3261R10ML□ -□□□
MS3261R12ML□ -□□□
MS3261R15ML□ -□□□
MS3261R18ML□ -□□□
MS3261R22ML□ -□□□
MS3261R27ML□ -□□□
MS3261R33ML□ -□□□
MS3261R39ML□ -□□□
MS3261R47ML□ -□□□
MS3261R56ML□ -□□□
MS3261R68ML□ -□□□
MS3261R82ML□ -□□□
MS32611R0ML□ -□□□
MS32611R2ML□ -□□□
MS32611R5ML□ -□□□
MS32611R8ML□ -□□□
MS32612R2ML□ -□□□
MS32612R7ML□ -□□□
MS32613R3ML□ -□□□
MS32613R9ML□ -□□□
MS32614R7ML□ -□□□
MS32615R6ML□ -□□□
MS32616R8ML□ -□□□
MS32618R2ML□ -□□□
MS3261100ML□ -□□□
Inductance
(
μH
)
0.047±20%
0.068±20%
0.100±20%
0.120±20%
0.150±20%
0.180±20%
0.220±20%
0.270±20%
0.330±20%
0.390±20%
0.470±20%
0.560±20%
0.680±20%
0.820±20%
1.000±20%
1.200±20%
1.500±20%
1.800±20%
2.200±20%
2.700±20%
3.300±20%
3.900±20%
4.700±20%
5.600±20%
6.800±20%
8.200±20%
10.000±20%
Q
min
20
20
20
20
20
20
20
20
20
25
25
25
25
25
45
45
45
45
45
45
45
45
45
50
50
50
50
Test Freq.
(MHz)
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
4
4
2
SRF
( MHz )
min.
320
280
235
220
200
185
170
150
145
135
125
115
105
100
75
65
60
55
50
45
41
38
35
32
29
26
24
RDC
(
Ω
)
max
0.15
0.25
0.25
0.30
0.30
0.40
0.40
0.50
0.60
0.50
0.60
0.70
0.80
0.90
0.40
0.50
0.50
0.50
0.60
0.60
0.70
0.80
0.90
0.70
0.80
0.90
1.00
IDC
( mA )
max
300
300
250
250
250
250
250
250
250
200
200
150
150
150
100
100
50
50
50
50
50
50
50
25
25
25
25
1).
□：Packaging
Information… A：Bulk B：Taping Reel
2)."-
□□□
":Reference code
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
ABC'S DWG NO.
PAGE: 3
MULTILAYER CHIP INDUCTOR
ABC'S ITEM NO.
MS3261□□□□L□-□□□
Ⅵ﹒CURVE：
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 4
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MS3261□□□□L□-□□□
Ⅶ﹒PACKAGING
INFORMATION：
( 1 ) Configuration
T
Cover Tape
2.0±0.5
A
N
∮
C
∮
C
B
G
D
Embossed Cappier
※
Carrier tape width : D
P:4 m/m
End
4 m/m
Start
Leader
no component
200 m/m Min.
Components
User direction of feed
Trailer
no component
400 m/m Min.
( 2 ) Dimensions
Style
07 - 08
A
178
B
21±0.8
C
13
D
8
G
10 +0
N
50 -0
Unit:m/m
T
12.5
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Series
MS3261
Q'TY (pcs)
G.W. (gw)
Style
Q'TY (pcs)
Outer : Carton
G.W. (Kg)
Size (cm)
3,000
150
07 - 08
120,000
8.5
41 x 39 x 22
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 5
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MS3261□□□□L□-□□□
( 4 ) TYPE DIMENSIONS
1.75±0.1
(0.069±0.004)
Fig 2.
φ1.55±0.05
4±0.1
2±0.05
(0.157±0.004) (0.079±0.002) (0.061±0.002)
0.23±0.1(0.004)
F±0.05
(0.002)
B±0.1(0.004)
W±0.2
(0.008)
P±0.1
(0.004)
A±0.1
(0.004)
T±0.1(0.004)
Unit:m/m
Type
MS3261
A
1.88
B
3.50
F
3.50
P
4.0
T
1.27
W
8.0
Fig
2
AR-001A
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