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SMC1100R510JLF13

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 0.51ohm, 350V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, MELF, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size188KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

SMC1100R510JLF13 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 0.51ohm, 350V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 2512, MELF, ROHS COMPLIANT

SMC1100R510JLF13 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 2512
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeCYLINDRICAL PACKAGE
method of packingTR, 13 INCH
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance0.51 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn)
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage350 V
Base Number Matches1
Cylindrical Surface Mount
Metal Glaze™ Compliant
Terminal Resistors
SMC Series
Lead free, RoHS compliant
Uses standard IRC 2512, 3610 solder pads
Ideal for automotive and other harsh thermal applications
Uncompromising Metal Glaze™ performance gives excellent
surge performance
Capped terminals provide mechanical compliance-relief from
board vs. component TCE mismatch
Electrical Data
IRC
Type
SMC-1
SMC-2
Industry
Standard
Footprint
2512
3610
Power
Rating @ 70°C
(Watts)
1.0
2.0
Resistance
Range
(Ohms)
0.5 to 1M
0.5 to 2M
Tolerance
(±%)
1
1, 2, 5
1, 2, 5
TCR
(±ppm/°C)
100
100
Operating
Voltage
(V)
350
500
Maximum
Voltage
(V)
650
1000
Notes:
1
For tolerances below ±1%, please contact factory.
Environmental Data
Characteristics
Temperature Coefficient (ppm/°C)
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% +0.01Ω
±0.25% +0.01Ω
±0.5% +0.01Ω
±1% for (R>100KΩ)
±0.5% +0.01Ω
±0.25% +0.01Ω
95% minimum coverage
±0.5% +0.01Ω
±0.5% +0.01Ω
±1% +0.01
no mechanical damage
±1% +0.01
no mechanical damage
Test Method
MIL-PRF-55342E Par 4.7.9
(-55°C to +125°C)
MIL-PRF-55342E Par 4.7.3
(-65°C to +150°C)
MIL-PRF-55342E Par 4.7.4
(-65°C @ working voltage)
MIL-PRF-55342E Par 4.7.5
(2.5 x
PxR for 5 seconds)
MIL-PRF-55342E Par 4.7.6
(+150°C for 100 hours)
MIL-PRF-55342E Par 4.7.7
(Reflow soldered to board @ 260°C for 10 seconds)
MIL-STD-202, Method 208
(245°C for 5 seconds)
MIL-PRF-55342E Par 4.7.8
(10 cycles, total 240 hours)
MIL-PRF-55342E Par 4.7.10
(2000 hours @ 70°C intermittent)
1200 gram push from underside of
mounted chip for 60 seconds
Chip mounted in center of 90mm long board,
deflected 5mm so as to exert pull on chip contacts
for 10 seconds
-55°C to +150°C
Resistance to Board Bending
Operating Temperature
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
SMC Series Issue July 2009 Sheet 1 of 3
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