EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202AS-01-3973-C

Description
Fixed Resistor, Thin Film, 0.25W, 397000ohm, 100V, 0.25% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202AS-01-3973-C Overview

Fixed Resistor, Thin Film, 0.25W, 397000ohm, 100V, 0.25% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP

B0202AS-01-3973-C Parametric

Parameter NameAttribute value
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance397000 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.25%
Operating Voltage100 V
Base Number Matches1
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
EP2S30F484C4 pin diagram
I have searched for it online for a long time but couldn't find it!! I hope that the hero can give me a copy!! Thank you very much...
h_xq FPGA/CPLD
EEWORLD University Hall----Type C mobile power design with input and output fast charging mode
Type C mobile power design with input and output fast charging : https://training.eeworld.com.cn/course/3688...
hi5 Power technology
Who has used ADS? How to import PADS PCB into ADS?
Has anyone used ADS? How do I import a PCB from PADS into ADS? Any advice or information is welcome. Thanks in advance!...
kata PCB Design
The output voltage of the STM32 IO port is about 3.3V, but it cannot drive the motor? ?
Recently, I have been using the output level of the STM32 IO port to input the input of the L298N, and then used it to drive the motor. However, I don’t know why the output voltage of the L298N is alw...
wubaobao1993 stm32/stm8
How Active and Passive Cell Balancing Work
In the Power System Design article, “Active and Passive Balancing of Battery Management Systems,” Stefano Zanella describes how multi-cell systems can become unbalanced. In this article, I want to exp...
okhxyyo Analogue and Mixed Signal
Problems with Wince6.0 R3 system customization
为什么Run-time image can be larger than 32MB(IMGRAM64=1)选中后还会出现如下信息,nk.bin生成不了 Pass 1...Warning: Unable to do imports from ppp.dll to RSAENH.dll - will late bind Warning: Unable to do imports from schann...
woshis Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 510  692  1734  48  1603  11  14  35  1  33 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号