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1N6642D1A-JQRS.L1DE

Description
Rectifier Diode, 1 Element, 0.3A, 75V V(RRM), Silicon, HERMETIC SEALED, CERAMIC, DLCC1 VARIANT A, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size317KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

1N6642D1A-JQRS.L1DE Overview

Rectifier Diode, 1 Element, 0.3A, 75V V(RRM), Silicon, HERMETIC SEALED, CERAMIC, DLCC1 VARIANT A, 2 PIN

1N6642D1A-JQRS.L1DE Parametric

Parameter NameAttribute value
package instructionHERMETIC SEALED, CERAMIC, DLCC1 VARIANT A, 2 PIN
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH RELIABILITY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JESD-30 codeR-CBCC-N2
JESD-609 codee4
Number of components1
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-65 °C
Maximum output current0.3 A
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum repetitive peak reverse voltage75 V
Maximum reverse recovery time0.005 µs
surface mountYES
Terminal surfaceGOLD
Terminal formNO LEAD
Terminal locationBOTTOM
Base Number Matches1
SILICON EPITAXIAL
PLANAR DIODE
1N6642D1A
Low Leakage
Fast Switching
Low Forward Voltage
Hermetic Ceramic Package Designed as a Drop-In Replacement
for “MELF-4.5 (D-5D)”/ ”DO-213AA” Package.
Suitable for general purpose, switching applications.
Space Level and High-Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VBR
VRWM
IO
IFSM
PD
(1)
(1)
Breakdown Voltage
Working Peak Reverse Voltage
Average Rectified Output Current, TA = 75°C
Surge Current (half sine wave, tp = 8.3ms
TA = 75°C
Total Power Dissipation at
Total Power Dissipation at
Junction Temperature Range
Storage Temperature Range
Derate Above 75°C
TSP = 75°C
Derate Above 75°C
PD
TJ
Tstg
100V
75V
300mA
2.5A
TBD
TBD
TBD
TBD
-65 to +200°C
-65 to +200°C
THERMAL PROPERTIES
Symbols
R
θJA
(1)
Parameters
Thermal Resistance, Junction To Ambient
Thermal Resistance, Junction To Solder Pads. TSP = 25°C
Max.
TBD
TBD
Units
°C/W
°C/W
R
θJSP(IN)
Notes
(1)
Thermal PCB rating to be determined.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the MELF-4.5 (D-5D) device.
Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing orders.
Semelab Limited
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Email:
sales@semelab-tt.com
Document Number 8882
Issue 1
Page 1 of 4
Website:
http://www.semelab-tt.com
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