POWER RECTIFIER
DIODE
1N5550D3A / 1N5550D3B
•
•
VBR = 220V, IF = 5A, Standard Reverse Recovery Rectifier Diode
Light Weight Hermetic Ceramic Surface Mount Package
Designed as a Drop In Replacement for “D-5B” / “E-MELF”
Package
†
Switching Power Supply Applications
Space Level and High-Reliability Screening Options Available
•
•
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VBR
VRWM
IO
IO
(1)
IFSM
TJ
Tstg
Symbols
R
θJSP(IN)
R
θJA(PCB)
(3)
R
θJA(PCB)
(4)
Breakdown Voltage
Working Peak Reverse Voltage
Average Rectified Output Current, TSP = 130°C
Average Rectified Output Current, TA = 55°C
Surge Current, tp = 8.3ms
(2)
Junction Temperature Range
Storage Temperature Range
220V
200V
5A
3A
100A
-65 to +175°C
-65 to +175°C
THERMAL PROPERTIES
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
Max.
17
50
117
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 3.0A @ TA = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
≤
52°C/W. De-rate linearly 25mA/°C >55°C.
(2) TA = 25°C @ IO=3.0A and VRWM for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.5A @ TA = 55°C for PC boards where R
θJA(PCB)
≤
120°C/W. De-rate at 12.5mA/°C above TA = 55°C in this case.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5B device.
Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab plc
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 8814
Issue 2
Page 1 of 4
POWER RECTIFIER DIODE
1N5550D3A / 1N5550D3B
MECHANICAL DATA
A
D
DLCC3 Variant A (D3A)
PAD 1
PAD 2
DIMENSION
A
B
C
D
ANODE
CATHODE
mm
7.00 ±0.10
3.75 ±0.10
1.60 ±0.10
1.76 ±0.10
Inches
0.275 ±0.004
0.143 ±0.004
0.063 ±0.004
0.069 ±0.004
SML
D3A
C
C
1
2
A
B
D
DLCC3 Variant B (D3B)
PAD 1
PAD 2
PAD 3
DIMENSION
A
B
C
D
ANODE
CATHODE
LID CONTACT TO CATHODE*
mm
7.00 ±0.10
3.75 ±0.10
1.60 ±0.10
1.76 ±0.10
Inches
0.275 ±0.004
0.143 ±0.004
0.063 ±0.004
0.069 ±0.004
SML
D3B
C
C
1
2
3
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep
dielectric discharge in space applications; see the Space Weather link
www.semelab.co.uk/dlcc3.html
on the Semelab web site. Package variant
to be specified at order.
†
The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,
which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture
and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
)
*
A
B
C
mm
7.32
1.78
3.94
Inches
0.288
0.070
0.155
+
B
Soldering temperature should be 260°C for a
maximum of 10 seconds.
The physical dimensions for the DLCC3 ceramic package are designed
to be different from the published dimensions for the “D-5B” and “E-
MELF” outlines. The DLCC3 design fully utilises the recommended
solder footprint for the “D-5B” / “E-MELF” Package, and as such
presents a drop in replacement for existing board designs.
PACKAGE MASS
Gold Plated Solder Pad Finish = 150mg
Semelab plc
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 8814
Issue 2
Page 3 of 4
ULTRAFAST RECOVERY
POWER RECTIFIER DIODE
1N5550D3A / 1N5550D3B
SCREENING OPTIONS
Space Level (JQRS/ESA) and High Reliability options are
available in accordance with the
High Reliability and
Screening Options Handbook
available for download from
the from the TT electronics Semelab web site.
ESA Quality Level Products are based on the testing
procedures specified in the generic ESCC 5000 and in the
corresponding part detail specifications.
Semelab’s QR216 and QR217 processing specifications
(JQRS), in conjunction with the companies ISO 9001:2000
approval present a viable alternative to the American MIL-
PRF-19500 space level processing.
QR217 (Space Level Quality Conformance) is based on the
quality conformance inspection requirements of MIL-PRF-
19500 groups A (table V), B (table VIa), C (table VII) and
also ESA / ESCC 5000 (chart F4) lot validation tests.
QR216 (Space Level Screening) is based on the screening
requirements of MIL-PRF-19500 (table IV) and also ESA
/ESCC 5000 (chart F3).
JQRS parts are processed to the device data sheet and
screened to QR216 with conformance testing to Q217
groups A and B in accordance with MIL-STD-750 methods
and procedures.
Additional conformance options are available, for example
Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs.
These are chargeable and must be specified at the order
stage (See Ordering Information). Minimum order
quantities may apply.
Alternative or additional customer specific conformance or
screening requirements would be considered. Contact
Semelab sales with enquires.
ORDERING INFORMATION
Part numbers are built up from Type, Package Variant, and
screening level. The part numbers are extended to include
the additional options as shown below.
Type – See Electrical Stability Characteristics Table
Package Variant – See Mechanical Data
Screening Level – See Screening Options (ESA / JQRS)
Additional Options:
Customer Pre-Cap Visual Inspection
Customer Buy-Off visit
Data Pack
Solderability Samples
Scanning Electron Microscopy
Radiography (X-ray)
Total Dose Radiation Test
MIL-PRF-19500 (QR217)
Group B charge
Group B destructive mechanical samples
Group C charge
Group C destructive electrical samples
Group C destructive mechanical samples
ESA/ESCC
Lot Validation Testing (subgroup 1) charge
LVT1 destructive samples (environmental)
LVT1 destructive samples (mechanical)
Lot Validation Testing (subgroup 2) charge
LVT2 endurance samples (electrical)
Lot Validation Testing (subgroup 3) charge
LVT3 destructive samples (mechanical)
.CVP
.CVB
.DA
.SS
.SEM
.XRAY
.RAD
.GRPB
.GBDM (12 pieces)
.GRPC
.GCDE (12 pieces)
.GCDM (6 pieces)
.LVT1
.L1DE (15 pieces)
.L1DM (15 pieces)
.LVT2
.L2D (15 pieces)
.LVT3
.L3D (5 pieces)
Additional Option Notes:
1) All ‘Additional Options’ are chargeable and must be specified at order stage.
2) When Group B,C or LVT is required, additional electrical and mechanical destructive
samples must be ordered
3) All destructive samples are marked the same as other production parts unless
otherwise requested.
MARKING DETAILS
Parts can be laser marked with approximately 7 characters
on two lines and always includes cathode identification.
Typical marking would include part or specification number,
week of seal or serial number subject to available space and
legibility.
Customer specific marking requirements can be arranged at
the time of order.
Example Marking:
Example ordering information:
The following example is for the 1N5550D3 part with
package variant B, JQRS screening, additional Group C
conformance testing and a Data pack.
Part Numbers:
1N5550D3B-JQRS
(Include quantity for flight parts)
1N5550D3B-JQRS.GRPC
(chargeable conformance option)
1N5550D3B-JQRS.GCDE
(charge for destructive parts)
1N5550D3B-JQRS.GCDM
(charge for destructive parts)
1N5550D3B-JQRS.DA
(charge for Data pack)
Customers with any specific requirements (e.g. marking or
screening) may be supplied with a similar alternative part
number (there is maximum 20 character limit to part
numbers). Contact Semelab sales with enquiries
High Reliability and Screening Options Handbook link:
http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf
Semelab Limited
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Email:
sales@semelab-tt.com
Website:
http://www.semelab-tt.com
Document Number 8814
Issue 2
Page 4 of 4
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
