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15497911-153

Description
Card Edge Connector, 36 Contact(s), 2 Row(s), Male, Straight, Solder Terminal,
CategoryThe connector    The connector   
File Size246KB,2 Pages
ManufacturerDelphi Connection Systems
Download Datasheet Parametric View All

15497911-153 Overview

Card Edge Connector, 36 Contact(s), 2 Row(s), Male, Straight, Solder Terminal,

15497911-153 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknown
Connector typeCARD EDGE CONNECTOR
Contact point genderMALE
DIN complianceNO
Filter functionNO
IEC complianceNO
MIL complianceNO
Manufacturer's serial number15497911
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded2
OptionsGENERAL PURPOSE
Terminal pitch1 mm
Termination typeSOLDER
Total number of contacts36
Base Number Matches1
Connectivity and Integration
D e l p h i
P C I
E x p r e s s
T M
C o n n e c t o r s
Description –
1.0mm pitch card edge connectors
for PCI Express™ expansion slots. These
connectors support single (x1) or multiple (x4, x8,
x16) serial data lanes at 2.5 Gbps data rates per
lane. PCI Express connectors are the industr y
standard interface to replace parallel PCI bus
applications.
Typical Applications –
Desktop computers
Benefits/Features:
Industr y Standard . . .Meets all requirements of PCI
–SIG (Peripheral Component
Interface – Special Interest
Group) PCI Express Base
Specification.
Flexible System
. . . .Connectors are available in x1,
x4, x8, and x16 sizes.
Two solder tail lengths
provided for var ying PCB
thicknesses.
Ruggedness . . . . . . .Injection molded housings
have integral retention ledge.
Reliability . . . . . . . . .Several gold plating options
are available for improved
reliability.
Selectable Features
Product Type
Total No. of Positions
Centerline Spacing
Orientation
Mounting Style
Voltage
Insertion Style
Contact Style
Contact Area Plating
Height Above Board
Housing Color
PCI Express Card Edge Connectors
36 (x1), 64 (x4), 98 (x8), 164 (x16)
1.0 mm [.039 in.]
Vertical
Through hole
3.3 V
Card edge
Formed
Gold-plated (see product print for thickness)
11.25 mm [0.443 in.]
Black
Underplating
Standards
Approvals and Certification
Plating (Soldering End)
Ser vers
Other Properties
PCB Retention Feature
Packaging Type
Housing Material
Applicable Soldering Process
Contact Base Material
Insulation Resistance
Withstanding Voltage
Current Rating
Contact Resistance
Voltage Rating
Temperature Range
Card Insertion Force
Durability (Mating Cycles)
Plating (Contact Area)
No
Tube
Glass filled thermoplastic
IR, vapor phase, wave
Copper alloy
1,000 MΩ
500 VAC
1.1 amp max. per power contact
30 mΩ (initial)
25 VAC
-55°C to +85°C
1.15 N [117 gf] max. per contact pair
20
Gold (thickness varies per Delphi
spec.) over nickel
underplating
2.54 µm [100 µin.] tin-lead over
nickel underplating
(Lead free available, contact factory)
1.27 µm [50 µin.] nickel
PCI SIG PCI Express Specification
UL approved
www.delphi.com/connect
Connection Systems
19200 Asheville Highway
P
.O. Box 519, Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
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