I
NTEGRATED
C
IRCUITS
D
IVISION
Characteristics
Parameter
Blocking Voltage
Load Current, T
A
=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
R
JC
8.6
3.4
0.09
0.3
A
DC
°C/W
Single-Pole, Normally Open
ISOPLUS™-264 DC Power Relay
Description
Units
V
P
CPC1727
Rating
250
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1727 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500V
rms
of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V
rms
isolation, but also very low thermal
resistance (0.3 °C/W).
Features
•
•
•
•
•
•
•
•
•
•
8.6A
DC
Load Current with 5°C/W Heat Sink
Low 0.09 On-Resistance
250V
P
Blocking Voltage
2500V
rms
Input/Output Isolation
Low Thermal Resistance (0.3 °C/W)
Electrically Non-Conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Transportation Equipment
•
Aerospace/Defense
Ordering Information
Part
CPC1727J
Description
ISOPLUS-264 Package (25 per tube)
Approvals
•
UL 508 Certified Component: File E69938
•
CSA Certified Component: Certificate 1172007
Switching Characteristics
Form-A
I
F
90%
Pin Configuration
1
+
2
-
3
-
4
+
I
LOAD
t
on
10%
t
off
e
3
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I
NTEGRATED
C
IRCUITS
D
IVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
Ratings
250
5
100
1
150
2500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
V
rms
CPC1727
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
°C
°C
1.2 Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
1
Peak
Continuous
Continuous
Continuous
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Input-to-Output Capacitance
1
Conditions
Symbol
Minimum
Typical
Maximum
Units
t10ms
No Heat Sink
T
C
=25°C
T
C
=99°C
I
F
=10mA, I
L
=1A
V
L
=250V
P
30
I
L
I
L(99)
R
ON
I
LEAK
t
on
t
off
C
out
I
F
I
F
V
F
I
R
-
-
-
-
-
-
0.6
0.9
-
-
0.0675
-
5.5
0.125
700
-
-
1.2
-
1
-
-
3.4
20
4.2
0.09
1
20
5
-
10
-
1.4
10
-
A
P
A
DC
A
I
F
=20mA, V
L
=10V
V
L
=25V, f=1MHz
I
L
=1A
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
C
I/O
Higher load currents possible with proper heat sinking.
2
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (> 60ºC) a LED drive current of 20mA is recommended.
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I
NTEGRATED
C
IRCUITS
D
IVISION
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Conditions
-
Free Air
-
Symbol
R
JC
R
JA
CPC1727
Minimum
-
-
-40
Typical
-
33
-
Maximum
0.3
-
100
Units
°C/W
°C/W
°C
T
J
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
R
θCA
=
(T
J
- T
A
) I
L(99)2
I
L2
•
P
D(99)
- R
θJC
T
J
= Junction Temperature (°C), T
J
≤
100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current
with
Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤
I
L(MAX)
R
θJC
= Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
R
θCA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation
with
case temperature held at 99ºC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
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NTEGRATED
C
IRCUITS
D
IVISION
3 Performance Data
35
30
CPC1727
Typical Turn-On Time
(N=50, I
F
=20mA, I
L
=1A
DC
, T
A
=25ºC)
Typical Turn-Off Time
(N=50, I
F
=20mA, I
L
=1A
DC
, T
A
=25ºC)
25
20
15
10
5
0
35
30
Device Count (N)
25
20
15
10
5
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
, T
A
=25ºC)
Device Count (N)
25
20
15
10
5
0
3.75
4.50
5.25
6.00
6.75
7.50
Turn-On (ms)
Device Count (N)
0
0.095
0.105
0.115
0.125
0.135
0.145
0.0575 0.0600 0.0625 0.0650 0.0675 0.0700
On-Resistance (Ω)
Turn-Off (ms)
35
30
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA, I
L
=1A
DC
, T
A
=25ºC)
Typical Turn-On
vs. LED Forward Current
(I
L
=1A
DC
, T
A
=25ºC)
12
11
10
9
8
7
6
5
4
3
2
1
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
0.18
0.16
0.14
Turn-Off (ms)
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
5
Typical Turn-Off
vs. LED Forward Current
(I
L
=1A
DC
, T
A
=25ºC)
20
15
10
5
0
1.30
1.31
1.32
1.33
1.34
LED Forward Voltage (V)
Turn-On (ms)
25
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
Turn-On (ms)
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
14
12
10
8
6
4
2
0
-40
Typical Turn-On vs. Temperature
(I
L
=1A
DC
)
I
F
= 10mA
Turn-Off (ms)
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
Typical Turn-Off vs. Temperature
(I
L
=1A
DC
)
I
F
= 20mA
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
= 20mA
I
F
= 10mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
Typical Load Current
vs. Load Voltage
(I
F
=10mA, T
A
=25ºC)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
0.05
0.10
0.15
0.20
0.25
0.30
Load Voltage (V)
Maximum Load Current vs.
Temperature with Heatsink
20
1ºC/W
Load Current (A
DC
)
15
LED Current (mA)
Load Current (A)
10
5ºC/W
5
10ºC/W
Free Air
0
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
80
100
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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4
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC1727
0.18
0.16
On-Resistance (Ω)
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
290
285
Blocking Voltage (V
P
)
Blocking Voltage vs. Temperature
0.7
0.6
Leakage (μA)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=250V
P
)
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-40
-20
0
20
40
60
80
100
280
275
270
265
260
255
250
-40
-20
0
20
40
60
80
100
0.5
0.4
0.3
0.2
0.1
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
Free Air, No Heatsink
33
30
27
24
21
18
15
12
9
6
3
0
10μs 100μs 1ms 10ms 100ms
Time
Load Current (A)
1s
10s
100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
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