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HM5212165FLTD-75

Description
128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword 】 16-bit 】 4-bank/4-Mword 】 8-bit 】 4-bank PC/133, PC/100 SDRAM
Categorystorage    storage   
File Size693KB,62 Pages
ManufacturerELPIDA
Websitehttp://www.elpida.com/en
Download Datasheet Parametric Compare View All

HM5212165FLTD-75 Overview

128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword 】 16-bit 】 4-bank/4-Mword 】 8-bit 】 4-bank PC/133, PC/100 SDRAM

HM5212165FLTD-75 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerELPIDA
Parts packaging codeTSOP2
package instructionTSOP2, TSOP54,.46,32
Contacts54
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G54
JESD-609 codee0
length22.22 mm
memory density134217728 bi
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP54,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.22 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
HM5212165FLTD-75/A60/B60
HM5212805FLTD-75/A60/B60
Description
The HM5212165F L is a 128-Mbit S DRA M orga nized as 2097152-w ord
×
16-bit
×
4-ba nk. The
HM5212805FL is a 128-Mbit SDRAM organized as 4194304-word
×
8-bit
×
4-bank. All inputs and outputs are
referred to the rising edge of the clock input. It is packaged in standard 54-pin plastic TSOP II.
Features
3.3 V power supply
Clock frequency: 133 MHz/100 MHz (max)
LVTTL interface
Single pulsed
RAS
4 banks can operate simultaneously and independently
Burst read/write operation and burst read/single write operation capability
Programmable burst length: 1/2/4/8/full page
2 variations of burst sequence
Sequential (BL = 1/2/4/8/full page)
Interleave (BL = 1/2/4/8)
Programmable
CAS
latency: 2/3
Byte control by DQM : DQM (HM5212805FL)
: DQMU/DQML (HM5212165FL)
Refresh cycles: 4096 refresh cycles/64 ms
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
EO
128M LVTTL interface SDRAM
133 MHz/100 MHz
2-Mword
×
16-bit
×
4-bank/4-Mword
×
8-bit
×
4-bank
PC/133, PC/100 SDRAM
E0180H10 (Ver. 1.0)
Jul. 17, 2001
L
Pr
uc
od
t

HM5212165FLTD-75 Related Products

HM5212165FLTD-75 HM5212805FLTD-A60 HM5212805FLTD-75 HM5212165FLTD-A60
Description 128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword 】 16-bit 】 4-bank/4-Mword 】 8-bit 】 4-bank PC/133, PC/100 SDRAM 128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword 】 16-bit 】 4-bank/4-Mword 】 8-bit 】 4-bank PC/133, PC/100 SDRAM 128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword 】 16-bit 】 4-bank/4-Mword 】 8-bit 】 4-bank PC/133, PC/100 SDRAM 128M LVTTL interface SDRAM 133 MHz/100 MHz 2-Mword 】 16-bit 】 4-bank/4-Mword 】 8-bit 】 4-bank PC/133, PC/100 SDRAM
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker ELPIDA ELPIDA ELPIDA ELPIDA
Parts packaging code TSOP2 TSOP2 TSOP2 TSOP2
package instruction TSOP2, TSOP54,.46,32 TSOP2, TSOP54,.46,32 TSOP2, TSOP54,.46,32 TSOP2, TSOP54,.46,32
Contacts 54 54 54 54
Reach Compliance Code unknow unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 5.4 ns 6 ns 5.4 ns 6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 133 MHz 100 MHz 133 MHz 100 MHz
I/O type COMMON COMMON COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 code R-PDSO-G54 R-PDSO-G54 R-PDSO-G54 R-PDSO-G54
JESD-609 code e0 e0 e0 e0
length 22.22 mm 22.22 mm 22.22 mm 22.22 mm
memory density 134217728 bi 134217728 bi 134217728 bi 134217728 bi
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 16 8 8 16
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 54 54 54 54
word count 8388608 words 16777216 words 16777216 words 8388608 words
character code 8000000 16000000 16000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 8MX16 16MX8 16MX8 8MX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2 TSOP2
Encapsulate equivalent code TSOP54,.46,32 TSOP54,.46,32 TSOP54,.46,32 TSOP54,.46,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES YES
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.002 A 0.002 A 0.002 A 0.002 A
Maximum slew rate 0.22 mA 0.22 mA 0.22 mA 0.22 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm
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