EEWORLDEEWORLDEEWORLD

Part Number

Search

717DBG25P1BTNVFM

Description
D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, Plug,
CategoryThe connector    The connector   
File Size991KB,6 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Download Datasheet Parametric View All

717DBG25P1BTNVFM Overview

D Subminiature Connector, 25 Contact(s), Male, Solder Terminal, Plug,

717DBG25P1BTNVFM Parametric

Parameter NameAttribute value
Objectid1677295555
Reach Compliance Codeunknown
YTEOL8.5
Other featuresSTANDARD: MIL-C-24308
body width0.488 inch
subject depth0.53 inch
body length2.083 inch
Body/casing typePLUG
Connector typeD SUBMINIATURE CONNECTOR
Contact point genderMALE
contact modeSTAGGERED
Contact styleRND PIN-SKT
DIN complianceNO
empty shellNO
Filter functionNO
IEC complianceNO
insulator materialGLASS FILLED POLYETHYLENE
MIL complianceYES
Plug contact pitch0.109 inch
Match contact row spacing0.11 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation option 1M3
Installation option 2INSERT
Installation methodRIGHT ANGLE
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
OptionsGENERAL PURPOSE
PCB contact patternSTAGGERED
PCB contact row spacing2.84 mm
Rated current (signal)7.5 A
Shell surfaceTIN
Shell materialSTEEL
Housing size3/B
Terminal pitch2.76 mm
Termination typeSOLDER
Total number of contacts25
UL Flammability Code94V-0
Fixed Machined Contact Connector
D-DF S
ERIES
Standards:
• UL File:
E119881
• Connectors according to MIL C24308
S
PECIFICATIONS
:
M
ATERIALS
Shells
AND
P
LATINGS
Steel yellow chromated over zinc or tinned steel
with or without dimples on plug connector
Insulator
Glass-filled thermoplastic, UL 94V-0
Rear Insert
Brass, 118µ" up to 197µ" (3µm up to 5µm)
tinned over nickel 78µ" up to 118µ"
(2µm up to 3µm)
Boardlock
Tin-lead plating 157µ" up to 236µ"
(4µm up to 6µm) over nickel
78µ" up to 118µ" (2µm up to 3µm)
Screwlock
Brass, 236µ" up to 394µ"
(6µm up to 10µm) tinned over nickel 78µ"
up to 118µ" (2µm up to 3µm)
Contacts
D: brass
DF: pin = brass
Socket = copper alloy
Right Angle Version
Selective gold in mating area over 78µ"
up to 118µ"
(2µm up to 3µm) nickel; 118µ" up to 197µ"
(3µm up to 5µm) tin-lead on termination area
over 78µ" up to 118µ" (2µm up to 3µm) nickel
Straight Version
Full gold plating over 78µ" up to 118µ"
(2µm up to 3µm) nickel
The Amphenol SD series features
precision formed contacts, and 4
finger boardlocks.
This series gives you Amphenol’s
high standards of quality and
reliability to meet all of your
commercial requirements.
E
LECTRICAL
D
ATA
Current Rating
Voltage Rating
Withstanding Voltage
Insulation Resistance
Contact Resistance
7.5 A
300 V AC/rms 50Hz
1000V AC/rms 50Hz for one minute
5000MΩ
D: 8.5mΩ max.
DF: 5mΩ max.
• Industrial
• Telecom
• Any industry standard
I / O connections
C
LIMATIC
D
ATA
Operating Temperature
D: -67°F (-55°C) to +185°F (85°C),
peak at 257°F (125°C)
DF: -67°F (-55°C) to + 257°F (125°C)
M
ECHANICAL
D
ATA
No. of Contacts
9
15
25
37
50
(size E)
(size A)
(size B)
(size C)
(size D)
Mate (max.)
6.74 (3.05)
11.24 (5.09)
18.66 (8.44)
27.65 (12.51)
32.38 (14.65)
Unmate (min.)
0.79
1.01
1.8
2.47
3.56
(0.36)
(0.46)
(0.81)
(1.1)
(1.6)
I
NCHES
(
MM
)
20
T
ELEPHONE
: (416) 754-5656 F
AX
: (416) 754-8668
E-M
AIL
:
SALES
@
AMPHENOLCANADA
.
COM
How to use EVc to output a double data on the screen?
How to display a double data, messagebox or something like that, I just want to see what the data is......
f14tomcat_2001 Embedded System
Show off the mobile power bank in the answer question
The mobile power bank is very delicate, I like it very much. . . The second phase of the activity is in progress, friends, it is better to take action than to be moved. [url=https://bbs.eeworld.com.cn...
huixianfxt Talking
The integrated infrared head actually filters out useful signals
[font=宋体][size=5]I recently wanted to make a beaming infrared alarm device. I have almost finished it, but I was stumped by the integrated infrared remote control head. [/size][/font] [font=宋体][size=5...
my_love_dream Analog electronics
Fudan Micro MCU Development Notes and MCU Chip Package Library
[i=s]This post was last edited by Jacktang on 2021-7-7 08:31[/i]You can download and save it for use!...
Jacktang Domestic Chip Exchange
AD information compilation
AD: Analog-to-digital conversion, converting analog signals into digital signals for easy processing by digital devices. Some AD posts on forums are sorted out, as well as some information collected f...
soso MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1033  2110  2739  2430  1719  21  43  56  49  35 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号