HD6473834UX datasheet, PDF - EEWORLD Datasheet

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HD6473834UX: DescriptionSingle-Chip Microcomputer; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，497 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD6473834UX Overview

Single-Chip Microcomputer

HD6473834UX Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
package instruction	TFQFP,
Contacts	100
Reach Compliance Code	unknown
Has ADC	YES
Other features	OPERATES AT 2.7V MINIMUM SUPPLY @ 500 KHZ
Address bus width
bit size	8
maximum clock frequency	5 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
Number of I/O lines	84
Number of terminals	100
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
rom(word)	32768
ROM programmability	OTPROM
Maximum seat height	1.2 mm
speed	5 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but

there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire

or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)

placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or

mishap.

Notes regarding these materials

These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation

product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any

other rights, belonging to Renesas Technology Corporation or a third party.

Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,

originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in

these materials.

All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents

information on products at the time of publication of these materials, and are subject to change by Renesas Technology

Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product

information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these

inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various means, including the

Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).

When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and

algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of

the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other

loss resulting from the information contained herein.

Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used

under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an

authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for

any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea

repeater use.

The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these

materials.

If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license

from the Japanese government and cannot be imported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is

prohibited.

Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.

Contents

Section 1

1.1

1.2

1.3

Overview

..........................................................................................................

Overview.........................................................................................................................

Internal Block Diagram ..................................................................................................

Pin Arrangement and Functions .....................................................................................

1.3.1 Pin Arrangement.................................................................................................

1.3.2 Pin Functions ......................................................................................................

Section 2

2.1

CPU

................................................................................................................... 13

2.2

2.3

2.4

2.5

2.6

2.7

Overview.........................................................................................................................

2.1.1 Features...............................................................................................................

2.1.2 Address Space.....................................................................................................

2.1.3 Register Configuration........................................................................................

Register Descriptions......................................................................................................

2.2.1 General Registers................................................................................................

2.2.2 Control Registers ................................................................................................

2.2.3 Initial Register Values.........................................................................................

Data Formats...................................................................................................................

2.3.1 Data Formats in General Registers .....................................................................

2.3.2 Memory Data Formats ........................................................................................

Addressing Modes ..........................................................................................................

2.4.1 Addressing Modes ..............................................................................................

2.4.2 Effective Address Calculation ............................................................................

Instruction Set.................................................................................................................

2.5.1 Data Transfer Instructions ..................................................................................

2.5.2 Arithmetic Operations ........................................................................................

2.5.3 Logic Operations ................................................................................................

2.5.4 Shift Operations ..................................................................................................

2.5.5 Bit Manipulations ...............................................................................................

2.5.6 Branching Instructions........................................................................................

2.5.7 System Control Instructions ...............................................................................

2.5.8 Block Data Transfer Instruction .........................................................................

Basic Operational Timing ...............................................................................................

2.6.1 Access to On-Chip Memory (RAM, ROM) .......................................................

2.6.2 Access to On-Chip Peripheral Modules .............................................................

CPU States ......................................................................................................................

2.7.1 Overview.............................................................................................................

2.7.2 Program Execution State ...................................................................................

2.7.3 Program Halt State..............................................................................................

2.7.4 Exception-Handling State...................................................................................

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