The UT54ALVC2525 is a low-voltage, minimum skew, one-
to-eight clock driver. The UT54ALVC2525 distributes a single
clock to eight, high-drive, outputs with low skew across all
outputs during both the t
PLH
and t
PHL
transitions making it
ideal for signal generation and clock distribution. The output
pins act as a single entity and will follow the state of the CLK
pin.
O
0
O
2
NC
GND
V
CC
O
4
O
6
1
2
3
4
5
6
7
14
13
12
11
10
9
8
O
1
O
3
CLK
V
CC
GND
O
5
O
7
PIN DESCRIPTION
Flatpack
Pin No.
12
3
1, 2, 6, 7, 8, 9,
13, 14
5, 11
4, 10
Name
CLK
N/C
O
n
V
DD
V
SS
I/O
I
--
O
PWR
PWR
Type
LVTTL
--
LVTTL
Power
Power
Description
Primary reference clock input. This pin must be driven by an LVTTL or
LVCMOS clock source.
No connect.
Eight output clocks.
Power supply for internal circuitry and output buffers.
Ground
RADIATION HARDNESS
The UT54ALVC2525 incorporates special design, layout, and
process features which allows operation in a limited radiation
environment.
Parameter
Total Ionizing Dose (TID)
Single Event Latchup (SEL)
1, 2
Onset Single Event Upset (SEU) LET
Threshold
3, 4
Limit
>1E6
>109
>109
1.0E14
TBD
TBD
Units
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
rads(Si)/sec
rads(Si)/sec
Neutron Fluence
Dose Rate Upset
Dose Rate Survivability
IN
D
EV
EL
2
Notes:
1. The UT54ALVC2525 is latchup immune to particle LETs >109 MeV-cm
2
/mg.
2. SEL temperature and voltage conditions of T
C
= +125
o
C, V
DD
= 3.6V.
3. SEU worst case temperature and voltage conditions of T
C
= +25
o
C, V
DD
=
3.0V.
4. For the UT54ALVC2525 SET performance at select operating frequency
data ranges, please contact the factory.
O
PM
EN
T
ABSOLUTE MAXIMUM RATINGS:
1
(Referenced to V
SS
)
Symbol
V
DD
V
IN
V
OUT
I
I
P
D
T
STG
T
J
Θ
JC
ESD
HBM
Description
Core Power Supply Voltage
Voltage Any Clock Input
Voltage Any Clock Output
DC Input Current
Maximum Power Dissipation
Storage Temperature
Maximum Junction Temperature
2
Thermal Resistance, Junction to Case
ESD Protection (Human Body Model) - Class II
Limits
-0.3 to 4.0
-0.3 to V
DD
+ 0.3
-0.3 to V
DD
+ 0.3
+10
TBD
-65 to +150
+150
20
>3000
Units
V
V
V
mA
W
°C
°C
°C/W
V
RECOMMENDED OPERATING CONDITIONS:
Symbol
V
DD
V
IN
V
OUT
T
C
Core Operating Voltage
Voltage Clock Input
Voltage Any Clock Output
PM
Description
EN
T
Notes:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability and performance.
2. Maximum junction temperature may be increased to +175°C during burn-in and steady-static life.
Limits
2.0 to 3.6
0 to V
DD
0 to V
DD
Units
V
V
V
°C
IN
D
EV
EL
3
Case Operating Temperature
O
-55 to +125
DC OUTPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)*
(V
DD
= 2.0V to 3.6V; T
C
= -55°C to +125°C)
Symbol
Description
Conditions
V
DD
2.0V
2.75V
3.0V
3.6V
2.0V
2.75V
3.0V
3.6V
I
OL
= 12mA
I
OL
= 12mA
I
OL
= 12mA
I
OL
= 12mA
I
OH
= -12mA
I
OH
= -12mA
I
OH
= -12mA
I
OH
= -12mA
V
OUT
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
2.0V
2.75V
3.0V
3.6V
2.0V
2.75V
3.0V
3.6V
2.0V
3.6V
3.6V
1.6
2.2
2.4
3.0
Min.
1.25
1.5
1.75
2.0
Max.
Units
V
IH1
High level input voltage
V
V
IL1
Low level input voltage
0.7
0.8
0.8
0.8
0.4
0.4
0.4
0.4
V
V
OL
Low level output voltage
V
V
OH
High level output voltage
V
T
-1
I
OS2
I
IL
Short-circuit output current
Input leakage current
-300
-600
300
600
1
mA
µΑ
I
DDQ
Quiescent Supply Current
Pre-Rad 25
o
C
Pre-Rad -55
o
C to +125
o
C
Post-Rad 25
o
C
Pre-Rad 25
o
C
Pre-Rad -55
o
C to +125
o
C
Post-Rad 25
o
C
V
IN
= V
DD
or V
SS
EN
PM
2.0V
2.0
mA
mA
mA
mA
mA
mA
1
2
mW/MHz
mW/MHz
mW/MHz
mW/MHz
mW/MHz
mW/MHz
TBD
TBD
3.6V
4.0
TBD
TBD
2.0V
2.75V
3.0V
3.6V
0V
0V
P
TOTAL
Total power dissipation
EV
C
L
= 50pF
EL
O
IN
C
IN4
C
OUT4
D
2.5
3.75
15
15
mW/MHz
Input capacitance
f = 1MHz
f = 1MHz
pF
pF
Output capacitance
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si).
1. Functional tests are conducted in accordance with MIL-STD-883 with the following test conditions: V
IH
=V
IH
(min) +20%, -0% V
IL
=V
IL
(max)+0%, -50%, as
specified herein for the LVTTL and LVCMOS inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed to
V
IH
(min), V
IL
(max).
2. Supplied as a design limit. Neither guaranteed nor tested.
3. When measuring the dynamic supply current, all outputs are loaded in accordance with the equivalent test load defined in figure 3.
4. Capacitance is measured for initial qualification and when design changes may affect the input/output capacitance. Capacitance is measured between the designated
terminal and the VSS at a frequency of 1MHz and a signal amplitude of 50mV rms maximum.
4
AC OUTPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)*
(V
DD
= 2.0V to 3.6V; T
C
= -55°C to +125°C)
(Note 1, 2)
DUT
Description
Input rise/fall time
Propagation delay:
CLK to On,
high-to-low transition
Propagation delay:
CLK to On,
low-to-high transition
Maximum skew:
common edge,
output-to-output,
low-to-high transition
Maximum skew:
common edge,
output-to-output,
CLK
high-to-low transition
Output rise/fall time
V
Qn
V
DD
DD
Condition
V
IH
(min) - V
IL
(max)
Measured as transition time between
V
IN
= V
DD
÷2
to V
OUT
= V
DD
÷2
V
DD
C
L
3.6V
2.0V
2.75V
3.0V
3.6V
2.0V
2.75V
3.0V
3.6V
2.0V
2.75V
3.0V
3.6V
2.0V
2.75V
3.0V
3.6V
V
DD
/2
Min.
Max.
20
Unit
ns/V
150Ω
100Ω
3.5
3.0
DUT
2.75
2.25
3.25
2.75
2.5
2.0
7.5
5.5
5.25
4.75
7.25
5.25
5.0
4.5
ns
Measured as
Figure 3.
time between
transition
V
IN
=
Load
to V
OUT
Dynamic
Output Test
V
DD
÷2
Circuit
= V
DD
÷2
Power
100Ω
ns
150Ω
C
L
Supply Current Measurements
0.7
Figure 4.
0.55
Clock Output AC Test Load Circuit
ns
0.55
Note: This is not the recommended termination
0.5
for normal user operation.
O
0
Part-part skew
O
7
Propagation delay balance:
difference between same output,
low-to-high and
high-to-low transitions
Maximum skew:
opposite edge,
output-to-output variation
Measured as transition time between
to V
OUT
= V
DD
÷2
V
IN
= V
DD
÷2
t
PHL
O
5
t
OSHL
Measured as transition time between
V
IN
= V
DD
÷2
to V
OUT
= V
DD
÷2
2.0V
2.75V
t
PLH
3.0V
3.6V
t
2.0V
2.75V
3.0V
3.6V
PM
OSLH
Skew between the outputs of any two devices under
identical settings and conditions
(V
DD
, temp, air flow, frequency, etc).
V
DD
/2
2.0V
3.6V
EN
0.75
0.50
Measured as transition time between
20% * V
DD
and 80% * V
DD
2.0V
3.6V
1.0
0.75
2.0
1.5
V
DD
/2
0.75
0.5
0.35
0.3
0.5
0.25
0.18
0.1
ns
EL
Figure 5. AC Timing Diagram
IN
D
Notes:
* Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si).
1. Test load = 40pF, terminated to V
DD
÷
2. All outputs are equally loaded. Reference figure 4 for clock output loading that is equivalent to the load circuit used for all
AC testing.
2. Reference Figures 5 and 6 for AC timing diagrams.
3. Supplied only as a design guideline, neither tested nor guaranteed.
4. Guaranteed by characterization, but not tested.
[Source: Fresh Date Classroom]
These days, the internet is full of news about the college entrance examination. As usual, some students forgot to bring their admission tickets, some went to the wrong ...
When I was writing the H-bridge design software for TCU, the temperature of DRV8703-Q1 was normal before flashing the H-bridge software. However, after flashing the H-bridge related software, the temp...
[font="][size=16px][b]AD9850 Driver--MSP430 Version[/b][/size][/font] [font=Tahoma, Helvetica, SimSun, sans-serif]I was busy drawing boards, doing op amps and filtering some time ago, and rarely updat...
[i=s]This post was last edited by chenzhufly on 2015-1-16 21:32[/i] [size=4]By default, the board has nothing after powering on. You can only burn a system yourself to see how it works. For the benefi...
With the rapid development of technology, automotive intelligence is increasing at an unprecedented rate. This not only enhances vehicle functionality and comfort, but also places higher deman...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
New energy pure electric vehicles generally accelerate faster than comparable fuel-powered vehicles, both from a standing start and while accelerating. Many believe this is simply due to the motor'...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
A human-machine interface (HMI) refers to the platform used by people to operate a PLC. This platform provides an interface between programs and humans, serving as a medium for information transmis...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
Electric vehicles will revolutionize transportation, changing fuel consumption, carbon emissions, costs, maintenance, and driving habits. Currently, a major selling point for electric vehicles is t...[Details]
introduction
With the development of society, people's requirements for the quality of refrigerated and frozen foods are constantly improving. The changes in food appearance and nutritional co...[Details]
introduction
A common voltage regulator is a three-terminal one. Its function is to step down the voltage and stabilize it at a fixed output value. Voltage regulators are commonly available in...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
In microwave amplification circuits, the power chip is the core of the entire circuit. A large number of semiconductor devices in the chip will generate a lot of heat when working. If the heat diss...[Details]
The automotive driveshaft is a crucial connecting component in the automotive mechanical system. It is a circular component that allows for connection or assembly, as well as movement and rotation....[Details]
In July 2025, stimulated by the "old for new" policy, China's new energy vehicle penetration rate reached a historic 50% mark. While industry experts like Cui Dongshu celebrated the market's perfor...[Details]
1. Static Balance
Static balancing is performed on one correction surface of the rotor. The remaining unbalance after correction is used to ensure that the rotor is within the specified range ...[Details]
Real-time operating system RTOS
京公网安备 11010802033920号
EEWORLD
