Metal Glaze™ Cylindrical
Surface Mount
Power Resistors
CHP Series
•
•
•
•
•
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
Solder over nickel
barrier
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
High
temperature
dielectric
coating
Electrical Data
Size
Code¹
Industry
Footprint
IRC
Type
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
B
1206
CHP 1/8
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
D
2010
CHP 1/2
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
F
2512
CHP 1
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
H
3610
CHP 2
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
√
P x R
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
¹See page 8 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
√
for 5 seconds
MIL-R-55342E Par 4.7.6 (-150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted cchip for 60 seconds
Chip mounted in center of 90mm long board, deflected 1mm so as to
exert pull on chip contacts for 5 seconds
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
CHP Series Issue September 2008 Sheet 1 of 3
Metal Glaze™ Cylindrical
Surface Mount
Power Resistors
Physical Data
IRC Advanced Film Division
L
C
W
Size Code
B
C
D
E
F
H
Industry
Footprint
1206
1206
2010
2010
2512
3610
Dimensions (Inches and (mm)
Actual Size
L
0.128 ± 0.007
(3.25 ± 0.18)
0.128 ± 0.007
(3.25 ± 0.18)
0.200 ± 0.010
(5.08 ± 0.25)
0.200 ± 0.010
(5.08 ± 0.25)
0.251 ± 0.010
(6.38 ± 0.25)
0.367 ± 0.010
(9.32 ± 0.25)
W
0.057 ± 0.006
(1.45 ± 0.15)
0.063 ± 0.010
(1.60 ± 0.25)
0.079 ± 0.006
(2.01 ± 0.15)
0.105 ± 0.006
(2.67 ± 0.15)
0.079 ± 0.006
(2.01 ± 0.15)
0.105 ± 0.006
(2.67 ± 0.15)
C
0.020 ± 0.010
(0.51 ± 0.25)
0.020 ± 0.010
(0.51 ± 0.25)
0.030 ± 0.010
(0.761 ± 0.25)
0.040 ± 0.015
(1.02 ± 0.38)
0.040 ± 0.010
(1.02 ± 0.25)
0.050 ± 0.010
(1.27 ± 0.25)
Recommended Solder Pad Dimensions (Reflow):
F
A
C
A
B
E
D
Size
Code
B&C
D
E
F
H
Industry
Footprint
1206
2010
2010
2512
3610
Dimensions (Inches and mm))
A
0.076
(1.93)
0.111
(2.82)
0.170
(4.32)
0.121
(3.07)
0.170
(4.32)
B
0.093
(2.36)
0.126
(3.20)
0.160
(4.06)
0.126
(3.20)
0.160
(4.06)
C
0.058
(1.47)
0.096
(2.44)
0.072
(1.83)
0.127
(3.23)
0.213
(5.41)
D
0.098
(2.49)
0.152
(3.86)
0.132
(3.35)
0.183
(4.65)
0.273
(6.93)
E
0.032
(0.81)
0.040
(1.02)
0.044
(1.12)
0.040
(1.02)
0.044
(1.12)
F
0.211
(5.36)
0.318
(8.08)
0.412
(10.46)
0.369
(9.37)
0.553
(14.05)
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CHP Series Issue September 2008 Sheet 2 of 3
Metal Glaze™ Cylindrical
Surface Mount
Power Resistors
Standard Reel Packaging per EIA-481:
Size
Code
B&C
D
E
F
H
Industry
Footprint
1206
2010
2010
2512
3610
Reel
Diameter*
7″
13″
7″
13″
7″
13″
13″
7″
Quantity
Per Reel
2,500 max.
10,000 max.
1,500 max.
5,000 max.
1,500 max.
5,000 max.
5,000 max.
1,500 max.
IRC Advanced Film Division
Carrier Tape
Width
8mm
12mm
12mm
12mm
24mm
Component
Pitch
4mm
4mm
4mm
4mm
4mm
*The 13″ reel is considered standard and will be supplied unless otherwise specified.
Power Derating Curve
100
CHP 1/8, 1/2, 1
Repetitive Surge Curve
1000
% of Rated Power
80
Peak Power (watts)
CHP 2
100
60
CHP 2
CHP 1
40
20
0
10
CHP 1/8
30
40
50 60
70
80
90 100 110 120 130 140 150
1
0.0001
.1msec
Ambient Temperature (°C)
0.0010
1msec
0.0100
10msec
100msec
0.1000
10000msec
1.0000
Surge or Pulse Duration (seconds)
Ordering Data
Sample Part No.
IRC Type
(CHP 1/8, CHP 1/2, CHP 1, or CHP 2)
Note: Use for repetitive pulses where the average power dissipation is
not to exceed the component rating at 70°C. Surge handling capacity
for low-repetitive surges may be significantly greater than shown above.
Contact factory for recommendations.
CHP 1
- 100
2203
F
13
LF
Temperature Coefficient
(50 ppm, 100 ppm)
Resistance Value
(100 ohms and greater - First 3 significant digits plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohms = R250
Tolerance
(C = 0.25%, D = 0.5%, F = 1.0%; G = 2.0%; J = 5.0%)
Packaging Code*
(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)
Lead Free Construction
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CHP Series Issue September 2008 Sheet 3 of 3
Embedded System
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