5962H9656501VEA datasheet, PDF

Datasheet> All Categories > logic> logic> 5962H9656501VEA

5962H9656501VEA: DescriptionBinary Counter, ACT Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16; Categorylogic logic; File Size322KB，20 Pages; ManufacturerCobham PLC

Download Datasheet Parametric View All

5962H9656501VEA Overview

Binary Counter, ACT Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDIP16, SIDE BRAZED, CERAMIC, DIP-16

5962H9656501VEA Parametric

Parameter Name	Attribute value
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
ECCN code	3A001.A.1.A
Other features	TCO OUTPUT
Counting direction	BIDIRECTIONAL
series	ACT
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
length	19.05 mm
Load capacitance (CL)	50 pF
Load/preset input	YES
Logic integrated circuit type	BINARY COUNTER
Maximum Frequency@Nom-Sup	63000000 Hz
MaximumI(ol)	0.008 A
Operating mode	SYNCHRONOUS
Number of digits	4
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Sup	23 ns
propagation delay (tpd)	22 ns
Certification status	Qualified
Filter level	38535V;38534K;883S
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
total dose	1M Rad(Si) V
Trigger type	POSITIVE EDGE
width	7.62 mm
minfmax	63 MHz
Base Number Matches	1

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

DATE (YR-MO-DA)

APPROVED

Update boilerplate to MIL-PRF-38535 requirements. – LTG

Update radiation features in section 1.5 and paragraph 4.4.4.4.

Update boilerplate paragraphs to current MIL-PRF-38535

requirements. - MAA

Update functional test condition V

=0.8V in table IA. Update radiation

features in section 1.5 and SEP test limit table IB. Update boilerplate

paragraphs to current MIL-PRF-38535 requirements. - MAA

To correct switching waveforms input/output test limits to figure 4. Add test

equivalent circuits and footnote 4 to figure 4. Delete class M requirements

throughout.—MAA

01-12-03

10-02-10

Thomas M. Hess

11-01-11

Thomas M. Hess

13-01-25

Thomas M. Hess

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Larry T. Gauder

CHECKED BY

Charles F. Saffle

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil

APPROVED BY

Monica L. Poelking

DRAWING APPROVAL DATE

96-12-20

REVISION LEVEL

MICROCIRCUIT, DIGITAL, RADIATION

HARDENED, ADVANCED CMOS,

SYNCHRONOUS 4-BIT UP/DOWN BINARY

COUNTER, TTL COMPATIBLE INPUTS,

MONOLITHIC SILICON

SIZE

CAGE CODE

67268

SHEET

1 OF 19

5962-96565

DSCC FORM 2233

APR 97

5962-E186-13

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those

cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

https://assist.dla.mil/quicksearch

or from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

ASTM INTERNATIONAL (ASTM)

ASTM F1192

- Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion

Irradiation of semiconductor Devices.

(Copies of these documents are available online at

http://www.astm.org

or from ASTM International, 100 Barr Harbor Drive,

P.O. Box C700, West Conshohocken, PA, 19428-2959).

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.

3.2.5 Switching waveforms and test circuits. The switching waveforms and test circuits shall be as specified on figure 4.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-96565

SHEET

3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post-irradiation parameter limits are as specified in table IA and shall apply over the

full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are described in table IA.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance

submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the

manufacturer's product meets, for device classes Q and V, the requirements of PMIL-PRF-38535 and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall

be provided with each lot of microcircuits delivered to this drawing.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-96565

SHEET

Recommended Resources

Complete AM Receiver Circuit 01

Infrared reciprocating device circuit

SHF620A type 5.3kV AC input optical coupling circuit

control function decoder

Transmitter circuit for contact combustion bridge sensor

Three types of light-controlled silicon controlled zero-crossing switch circuit diagrams

BQ27621-G1 write operation problem: I2C communication is used. There is no problem with I2C. It has been used in other chips. When writing the first byte, no response can be read and the function exits. But the following bytes can be re...; xushun716 MCU

Looking for methods and steps to use BSP components to create an independent executable program (a kind of Bootable) under VxWorks (Tornado2.2, VxWorks5.5.1, the version matching is best): I need to use BSP components under VxWorks to build an independent executable program. This program should be independent of bootrom (because of incremental development, there is no interface in the p...; ABCD19871242 Real-time operating system RTOS

TMS320C50 Example Programming Sharing: [size=4]Write a TMS320C50 program with interrupt function in C language and debug it with hardware emulator. [/size] [size=4]/*This program is a serial port input and output program of TMS320C50. TMS3...; 灞波儿奔 DSP and ARM Processors

Engineer, if you don't develop from the perspective of engineering or product, how can you be worthy of the word "engineering"...: The older you get, the more things you have to do and the more you think. People say that you are aggressive when you are young because you are young and fearless. You don’t think too much. Think abou...; 懒猫爱飞 Talking

1- Design of vending machine based on 51 single chip microcomputer (schematic diagram + PCB + paper + program): For more resources, follow the WeChat public account: Electronic Engineering DIY Studio No.: 0001Hardware composition:This design consists of STC series single chip microcomputer + 12864 display + pow...; 电子工程工作室 51mcu

Low power consumption design of PIC microcontroller in telephone remote controller: Combined with the low-power design of telephone remote controller, this paper discusses the low-power design method of PIC microcontroller and gives the design circuit schematic....; rain Microchip MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components