5962-9858701QXA datasheet, PDF

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5962-9858701QXA: DescriptionSerial IO/Communication Controller, CMOS, CPGA139,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size528KB，38 Pages; ManufacturerAeroflex; Websitehttp://www.aeroflex.com/

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5962-9858701QXA Overview

Serial IO/Communication Controller, CMOS, CPGA139,

5962-9858701QXA Parametric

Parameter Name	Attribute value
package instruction	PGA, PGA139,13X14MOD
Reach Compliance Code	unknown
JESD-30 code	R-XPGA-P139
Number of terminals	139
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	PGA
Encapsulate equivalent code	PGA139,13X14MOD
Package shape	RECTANGULAR
Package form	GRID ARRAY
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	855 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Update boilerplate to MIL-PRF-38535 requirements. - LTG

Update boilerplate to current MIL-PRF-38535 requirements. - CFS

Correct dimensions A, D, and E for case outline X, Figure1. Update boilerplate

to current MIL-PRF-38535 requirements. - PHN

DATE (YR-MO-DA)

01-04-05

07-08-03

13-03-04

APPROVED

Thomas M. Hess

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Larry T. Gauder

CHECKED BY

Thanh V. Nguyen

APPROVED BY

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil

Monica L. Poelking

DRAWING APPROVAL DATE

99-05-26

MICROCIRCUIT, DIGITAL, SERIAL MULTI-MODE

INTELLIGENT TERMINAL, REMOTE TERMINAL

ONLY, MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

SIZE

CAGE CODE

67268

1 OF

5962-98587

DSCC FORM 2233

APR 97

SHEET

5962-E282-13

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535

Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883

MIL-STD-1835

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103

MIL-HDBK-780

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).

2.2 Non-Government publications. The following document(s) form a part of this drawing to the extent specified herein.

Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)

IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture.

(Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane,

Piscataway, NJ 08855-1331).

(Non-Government standards and other publications are normally available from the organizations that prepare of distribute the

documents. These documents may also be available in or through libraries or other informational services.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Block diagram. The block diagram shall be as specified on figure 3.

3.2.4 Boundary scan instruction codes. The boundary scan instruction codes shall be as specified on figure 4.

3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 5.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-98587

SHEET

5962-9858701QXA Related Products

	5962-9858701QXA	5962-9858701QYC	5962-9858701QXC
Description	Serial IO/Communication Controller, CMOS, CPGA139,	Serial IO/Communication Controller, CMOS, CQFP132,	Serial IO/Communication Controller, CMOS, CPGA139,
package instruction	PGA, PGA139,13X14MOD	QFF, QFL132,.95SQ,25	PGA, PGA139,13X14MOD
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-XPGA-P139	S-XQFP-F132	R-XPGA-P139
Number of terminals	139	132	139
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	PGA	QFF	PGA
Encapsulate equivalent code	PGA139,13X14MOD	QFL132,.95SQ,25	PGA139,13X14MOD
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	GRID ARRAY	FLATPACK	GRID ARRAY
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum slew rate	855 mA	855 mA	855 mA
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal form	PIN/PEG	FLAT	PIN/PEG
Terminal pitch	2.54 mm	0.635 mm	2.54 mm
Terminal location	PERPENDICULAR	QUAD	PERPENDICULAR
Base Number Matches	1	1	1

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