REVISIONS
LTR
A
B
C
DESCRIPTION
Update boilerplate to MIL-PRF-38535 requirements. - LTG
Update boilerplate to current MIL-PRF-38535 requirements. - CFS
Correct dimensions A, D, and E for case outline X, Figure1. Update boilerplate
to current MIL-PRF-38535 requirements. - PHN
DATE (YR-MO-DA)
01-04-05
07-08-03
13-03-04
APPROVED
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
C
35
C
15
C
36
C
16
C
37
C
17
C
18
REV
SHEET
PREPARED BY
Larry T. Gauder
CHECKED BY
Thanh V. Nguyen
APPROVED BY
C
19
C
20
C
21
C
1
C
22
C
2
C
23
C
3
C
24
C
4
C
25
C
5
C
26
C
6
C
27
C
7
C
28
C
8
C
29
C
9
C
30
C
10
C
31
C
11
C
32
C
12
C
33
C
13
C
34
C
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
Monica L. Poelking
DRAWING APPROVAL DATE
99-05-26
MICROCIRCUIT, DIGITAL, SERIAL MULTI-MODE
INTELLIGENT TERMINAL, REMOTE TERMINAL
ONLY, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
SIZE
A
CAGE CODE
67268
1 OF
37
5962-98587
C
DSCC FORM 2233
APR 97
SHEET
5962-E282-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
98587
01
Q
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
UT69151RTE
Circuit function
Serial microcoded monolithic multi-mode
intelligent terminal, remote terminal only,
with +5 V/- 15 V operation
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
Terminals
139
140
132
Package style
Pin grid array
Quad flat pack
Quad flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98587
SHEET
C
2
1.3 Absolute maximum ratings.
1/
-65°C to +150°C
-55°C to +125°C
-0.3 V dc to +7.0 V dc
-0.3 V dc to +7.0 V dc
10 V
PL-L
5W
-0.3 V dc to V
DD
+ 0.3 V dc
±150
mA
±10
mA
1000 mA
+150°C
-5 V dc to +5 V dc
+300°C
7°C/W
Storage temperature range (T
STG
) ..............................................................................
Operating case temperature range (T
C
)......................................................................
Transceiver supply voltage range (V
CC
)......................................................................
Logic supply voltage range (V
DD
) ................................................................................
Input voltage range (receiver) (V
DR
)............................................................................
Maximum power dissipation (P
D
) ................................................................................
Logic voltage on any pin range (V
I/O
) ..........................................................................
Logic latch-up immunity (I
LU
) ......................................................................................
Logic input current (I
I
) ................................................................................................
Peak output current (transmitter) (I
O
) ..........................................................................
Maximum junction temperature (T
J
)............................................................................
Receiver common mode input voltage range (V
IC
) .....................................................
Lead temperature (soldering, 5 seconds) ...................................................................
Thermal resistance junction-to-case (θ
JC
): 2/
Cases X, Y and Z ...................................................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
DD
) and (V
CC
) ........................................................................
Receiver differential voltage (V
DR
) ..............................................................................
Logic dc input voltage range (V
IN
)...............................................................................
Receiver common mode input voltage (V
IC
) ...............................................................
Driver peak output current (I
O
) ....................................................................................
Serial data rate range (S
D
)..........................................................................................
Clock duty cycle (D
C
) ..................................................................................................
Case operating temperature range (T
C
)......................................................................
Operating frequency (F
IN
) ...........................................................................................
1.5 Digital logic testing for device classes Q and V.
+4.5 V dc to +5.5 V dc
8 V
P-P
0 V dc to V
DD
±5
V dc
700 mA
0 to 1 MHz
50
±
5%
-55°C to +125°C
24 MHz
±
0.01%
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, method 5012) ................................................................ 95.12 percent
__________
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability. This is a stress rating only, and functional operation of the
device at these or any other conditions beyond the limits indicated in the operational sections of this specification is not
recommended.
Mounting in accordance with MIL-STD-883, method 1012.
2/
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98587
SHEET
C
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).
2.2 Non-Government publications. The following document(s) form a part of this drawing to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture.
(Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane,
Piscataway, NJ 08855-1331).
(Non-Government standards and other publications are normally available from the organizations that prepare of distribute the
documents. These documents may also be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Boundary scan instruction codes. The boundary scan instruction codes shall be as specified on figure 4.
3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 5.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98587
SHEET
C
4
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein
.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
3.11 IEEE 1149.1 compliance. These devices shall be compliant to IEEE 1149.1.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98587
SHEET
C
5
Microcontroller MCU
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