REVISIONS
LTR
A
B
C
D
DESCRIPTION
Changes in accordance with N.O.R. 5962-R006-95.
Changes in accordance with N.O.R. 5962-R193-96.
Drawing updated to reflect current requirements. Redrawn. - ro
Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. - ro
DATE (YR-MO-DA)
94-10-21
96-08-21
00-04-21
05-05-03
APPROVED
M. A. FRYE
M. A. FRYE
R. MONNIN
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
PREPARED BY
JOSEPH A. KERBY
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, CURRENT FEEDBACK
AMPLIFIER, MONOLITHIC SILICON
DRAWING APPROVAL DATE
90-05-17
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
9
5962-89620
DSCC FORM 2233
APR 97
5962-E320-05
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89620
01
P
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
HA-5020
Circuit function
Current feedback amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
P
2
Descriptive designator
GDIP1-T8 or CDIP2-T8
CQCC1-N20
Terminals
8
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (±V
S
) ..............................................................
±18
V or 36 V
Input voltage (V
IN
) ..................................................................
±15
V or V
S
Differential input voltage .........................................................
±10
V
Input current (I
IN
) (-INPUT or +INPUT pins) ...........................
±10
mA
Input current (I
IN
) (BALANCE or DISABLE pins) ...................
±5
mA
Maximum power dissipation (P
D
) ............................................ 1.25 W
Peak output current (I
OP
) ....................................................... Short circuit protected
Output short circuit duration (I
OS
) ...........................................
Storage temperature range .....................................................
Lead temperature (soldering, 5 seconds) ...............................
Junction temperature (T
J
) .......................................................
Continuous 1/
-65°C to +150°C
+300°C
+175°C
Thermal resistance, junction-to-case (θ
JC
) ............................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
) :
Case P ................................................................................ 125°C/W
Case 2 ................................................................................. 100°C/W
______
1/ A heat sink is required to keep the junction temperature below the absolute maximum when the output is short circuited.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89620
SHEET
D
2
1.4 Recommended operating conditions.
Positive supply voltage (+V
S
) ................................................. +15 V
Negative supply voltage (-V
S
) ................................................. -15 V
Ambient operating temperature (T
A
) ....................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89620
SHEET
D
3
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
Unit
Open loop characteristics
Input offset voltage 2/
V
OS
V
CM
= 0 V
1
2,3
Common mode rejection
ratio
Power supply rejection
ratio
CMRR
PSRR
V
CM
=
±10
V
±4.5
V
≤
V
S
≤ ±18
V
1,2,3
1
2,3
Positive input resistance
Positive input current
+R
IN
+I
IN
V
CM
= 0 V
1,2,3
1,2
3
Negative input current 2/
-I
IN
1,2
3
Positive input current
power supply rejection
ratio
Negative input current
power supply rejection
ratio
Negative input current
common mode
rejection ratio
Open loop dc voltage
gain
+IPSRR
±4.5
V
≤
V
S
≤ ±18
V
1,2
3
-IPSRR
±4.5
V
≤
V
S
≤ ±18
V
1,2
3
-ICMRR
V
CM
=
±10
V
1,2
3
A
VOL1
R
L
= 400
Ω,
V
OUT
=
±10
V
A
VOL2
R
L
= 100
Ω,
V
OUT
=
±2.5
V
See footnotes at end of table.
4,5
6
4,5
6
01
70
60
60
55
01
01
01
01
01
01
01
01
01
-10
-15
50
65
60
1
-15
-25
-40
-50
+15
+25
+40
+50
0.5
1.0
0.5
1.0
2.0
4.0
dB
µA/V
µA/V
µA/V
µA
MΩ
µA
+10
+15
dB
dB
mV
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89620
SHEET
D
4
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
Unit
Open loop characteristics – continued.
Output voltage swing
V
O
R
L
= 400
Ω
4,5
6
Output current
I
OUT
R
L
= 400
Ω
4,5
6
Quiescent supply current
I
S
3/
1
2,3
Supply current, disabled
DISABLE current
Minimum DISABLE
current to disable
Maximum DISABLE
current to enable
AC closed loop characteristics.
Closed loop gain of
Slew rate
SR1
1 V/V (0 dB), R
L
= 400
Ω,
V
O
=
±10
V, R
F
= 1 kΩ
Slew rate
SR10
Closed loop gain of
10 V/V (20 dB),
R
L
= 400
Ω,
V
O
=
±10
V,
R
F
= 1 kΩ, R
G
= 111
Ω
Full power bandwidth 5/
FPBW1
Closed loop gain of
1 V/V (0 dB),
R
F
= 1 kΩ, T
A
= +25°C
See footnotes at end of table.
7
8 4/
7
8 4/
7
01
01
01
300
250
300
250
4.77
MHz
V/µs
V/µs
I
S
off
I
logic
I
d
I
e
3/
DISABLE voltage = 0 V
DISABLE voltage = 0 V
1,2,3
1,2,3
1,2,3
1,2,3
01
01
01
01
01
01
01
±12
±11
±30
±27.5
12
13
7.5
1.5
250
30
mA
mA
µA
µA
mA
mA
V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89620
SHEET
D
5
Embedded System
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