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EDS2516JEBH-75R3-E

Description
256M bits AS SDRAM
Categorystorage    storage   
File Size658KB,50 Pages
ManufacturerELPIDA
Websitehttp://www.elpida.com/en
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EDS2516JEBH-75R3-E Overview

256M bits AS SDRAM

EDS2516JEBH-75R3-E Parametric

Parameter NameAttribute value
MakerELPIDA
Parts packaging codeBGA
package instructionTFBGA,
Contacts54
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO REFRESH
JESD-30 codeR-PBGA-B54
length11 mm
memory density268435456 bi
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-5 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
PRELIMINARY DATA SHEET
256M bits AS SDRAM
EDS2516JEBH-75R3 (16M words
×
16 bits)
Description
The EDS2516JEBH-75R3 is a 256M bits AS SDRAM
(Application Specific SDRAM) organized as 4,194,304
words
×
16 bits
×
4 banks and specified suitable for
portable digital consumer electronics.
It is packaged in 54-ball FBGA.
Pin Configurations
/xxx indicate active low signal.
54-ball FBGA
1
A
VSS
DQ15 VSSQ
VDDQ
DQ0
VDD
2
3
4
5
6
7
8
9
EO
Features
2.5V power supply
Clock frequency: 133MHz (max.)
LVCMOS interface
Single pulsed /RAS
×16
organization
4 banks can operate simultaneously and
independently
Burst read/write operation and burst read/single write
operation capability
Programmable burst length (BL): 1, 2, 4, 8 and full
page
2 variations of burst sequence
Sequential (BL = 1, 2, 4, 8, full page)
Interleave (BL = 1, 2, 4, 8)
/CAS capability (CL): 3
Programmable driver strength: Half , Quarter
Byte control by UDQM and LDQM
Address
8K Row address /512 column address
Refresh cycles
8192 refresh cycles/16ms
Auto refresh capability
FBGA package with lead free solder (Sn-Ag-Cu)
RoHS compliant
B
DQ14 DQ13 VDDQ
VSSQ
DQ2
DQ1
C
DQ12 DQ11 VSSQ
VDDQ
DQ4
DQ3
D
DQ10
DQ9
VDDQ
VSSQ
DQ6
DQ5
E
DQ8
NC
VSS
VDD
LDQM
DQ7
Document No. E0811E10 (Ver. 1.0)
Date Published September 2005 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida
Memory, Inc. 2005
L
F
UDQM
CLK
CKE
/CAS
/RAS
/WE
G
A12
A11
A9
BA0
BA1
/CS
H
A8
A7
A6
A0
A1
A10
od
Pr
J
VSS
A5
A4
A3
A2
VDD
(Top view)
A0 to A12
BA0, BA1
DQ0 to DQ15
/CS
/RAS
/CAS
/WE
LDQM /UDQM
CKE
CLK
VDD
VSS
VDDQ
VSSQ
NC
Address inputs
Bank select address
Data input/ output
Chip select
Row address strobe
Column address strobe
Write enable
Input/output mask
Clock enable
Clock input
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
uc
t

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