5962H9322603VXC datasheet, PDF

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5962H9322603VXC: DescriptionMIL-STD-1553 Data Bus Transceiver, Bipolar, CDIP36, 0.100 INCH PITCH, SIDE BRAZED, DUAL CAVITY, DIP-36; CategoryWireless rf/communication Telecom circuit; File Size192KB，31 Pages; ManufacturerCobham PLC

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5962H9322603VXC Overview

MIL-STD-1553 Data Bus Transceiver, Bipolar, CDIP36, 0.100 INCH PITCH, SIDE BRAZED, DUAL CAVITY, DIP-36

5962H9322603VXC Parametric

Parameter Name	Attribute value
Maker	Cobham PLC
package instruction	DIP,
Reach Compliance Code	unknown
ECCN code	3A001.A.1.A
JESD-30 code	R-CDIP-T36
JESD-609 code	e4
Number of functions	1
Number of terminals	36
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Qualified
Maximum seat height	3.937 mm
Nominal supply voltage	5 V
surface mount	NO
technology	BIPOLAR
Telecom integrated circuit types	MIL-STD-1553 DATA BUS TRANSCEIVER
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
total dose	1M Rad(Si) V
width	15.24 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Add devices 03 and 04. Editorial changes throughout.

Changes in accordance with NOR 5962-R220-97.

Changes in accordance with NOR 5962-R297-97.

Add radiation features to paragraph 1.4 for device types 03 and 04. – LTG

Changes in accordance with NOR 5962-R062-99. – TVN

DATE (

YR-MO-DA

)

96-05-09

97-03-07

97-05-21

97-12-08

99-05-06

01-07-23

APPROVED

Monica L. Poelking

Thomas M. Hess

Correct dimensions for case outline Z in figure 1. Add radiation exposure

connections for case outline Z in figure 5. Update boilerplate to the

requirements of MIL-PRF-38535. Editorial changes throughout. – TVN

Add table IIB, Burn-in delta parameters. – CFS

Correct generic part number for device type 03. Update boilerplate to

MIL-PRF-38535 requirements. – CFS

03-10-21

06-05-02

Thomas M. Hess

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

REV

SHEET

PMIC N/A

PREPARED BY

Christopher A. Rauch

CHECKED BY

Thomas M. Hess

APPROVED BY

Monica L. Poelking

DRAWING APPROVAL DATE

94-05-02

REVISION LEVEL

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

MICROCIRCUIT, DIGITAL, BIPOLAR, DUAL CHANNEL,

BUS TRANSCEIVER, MONOLITHIC SILICON

SIZE

CAGE CODE

SHEET

67268

5962-93226

DSCC FORM 2233

APR 97

5962-E429-06

1.3 Absolute maximum ratings. 1/

Supply voltage range ........................................................................................... -0.3 V dc to +7.0 V dc

Input voltage range (receiver) .............................................................................. 10 V

Logic input voltage range ..................................................................................... -0.3 V dc to +5.5 V dc

Receiver common mode input voltage range....................................................... -5.0 V to +5.0 V

Outpur current (transmitter) ................................................................................. 1.0 A

Power dissipation, 100% duty cycle per channel: 2/

Device types 01, 02........................................................................................ 2.21 W

Device types 03, 04........................................................................................ 3.6 W

Storage temperature range .................................................................................. -65°C to +150°C

Thermal impedance, junction-to-case (Θ

Device types 01, 02........................................................................................ 4.5°C/W

Device types 03, 04........................................................................................ 6.0°C/W

Maximum junction temperature (T

Device types 01, 02........................................................................................ 125°C

Device types 03, 04........................................................................................ 175°C

1.4 Recommended operating conditions.

Supply voltage range (V

Device types 01, 02........................................................................................ +4.75 V dc to +5.25 V dc

Device types 03, 04........................................................................................ +4.5 V dc to +5.5 V dc

Logic input voltage range ..................................................................................... 0.0 V dc to +5.0 V dc

Receiver differential voltage................................................................................. 8.0 V

Receiver common mode voltage range ...............................................................

±4.0

V dc

Driver peak output current:

Device types 01, 02........................................................................................ 700 mA

Device types 03, 04........................................................................................ 600 mA

Serial data rate:

Device types 01, 02........................................................................................ 0 to 1 MHz

Device types 03, 04........................................................................................ 300 KHz to 1 MHz

Case operating temperature range (T

) ............................................................... -55°C to +125°C

Radiation features:

Total dose ...................................................................................................... 1 x 10

rads(Si)

Single event phenomenon (SEP) effective

LET, no upsets or latchup (see 4.4.4.5)....................................................

35 MeV/(mg/cm )

Dose rate upset (20 ns pulse) ........................................................................ 3/

Dose rate latchup........................................................................................... 3/

Dose rate survivability .................................................................................... 3/

Neutron irradiated ..........................................................................................

1 x 10

1.5 Digital logic testing for device classes Q and V.

Fault coverage measurement of manufacturing

logic tests (MIL-STD-883, test method 5012).................................................... 100 percent

__________

Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

= 5.0 V, T

= +25°C.

When characterized as a result of the procuring activities request, the condition will be specified.

Fault coverage is for digital circuits only.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-93226

SHEET

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

MIL-STD-1553 -

Test Method Standard Microelectronics.

Interface Standard Electronic Component Case Outlines.

Aircraft Internal Time Division Command/Response Multiplex Databus.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Block diagram. The block diagram shall be as specified on figure 3.

3.2.4 Timing waveforms. The timing waveforms shall be as specified on figures 4.

3.2.5 Radiation exposure connections. The radiation exposure connections shall be as specified on figure 5.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full

case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table IA.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-93226

SHEET

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and

herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or

for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 132 (see MIL-PRF-38535, appendix A).

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-93226

SHEET

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