5962-9317706QUX datasheet, PDF

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5962-9317706QUX: DescriptionFIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28,; Categorystorage storage; File Size195KB，32 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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5962-9317706QUX Overview

FIFO, 16KX9, 15ns, Asynchronous, CMOS, CDIP28,

5962-9317706QUX Parametric

Parameter Name	Attribute value
Maker	TEMIC
Reach Compliance Code	unknown
Maximum access time	15 ns
period time	25 ns
JESD-30 code	R-CDIP-T28
memory density	147456 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX9
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.84 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R227-93.

DATE (YR-MO-DA)

93-09-30

APPROVED

Michael A. Frye

Added packages Z and U and device types 04,05, and 06 to drawing.

Updated boilerplate. - glg

Added packages T and N. Added radiation features to appropriate

paragraphs. Updated boilerplate paragraphs. ksr

Corrected dose rate to 0.1 rads(Si)/s. Updated boilerplate

paragraphs. ksr

00-05-30

Raymond Monnin

01-12-18

Raymond Monnin

02-04-15

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Jeff Bowling

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY All

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

CHECKED BY

Jeff Bowling

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

MICROCIRCUIT, MEMORY,

DIGITAL, CMOS, 16K x 9

PARALLEL FIFO, MONOLITHIC

SILICON

SIZE

SHEET

CAGE CODE

93-06-09

REVISION LEVEL

67268

5962-93177

1 OF 30

5962-E257-02

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the

Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified

herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of

the DoDISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the

issues of the documents cited in the solicitation.

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM Standard F1192-95

Standard Guide for the Measurement of Single Event Phenomena from

Heavy Ion Irradiation of Semiconductor Devices.

(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,

1916 Race Street, Philadelphia, PA 19103.)

ELECTRONIC INDUSTRIES ALLIANCE (EIA)

JEDEC Standard EIA/JESD78

IC Latch-Up Test.

(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard,

Arlington, VA 22201.)

(Non-Government standards and other publications are normally available from the organizations that prepare or

distribute the documents. These documents also may be available in or through libraries or other informational services.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the

text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations

unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535, and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements

for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device

class M.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and on figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under

document revision level control and shall be made available to the preparing and acquiring activity upon request.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

SIZE

REVISION LEVEL

5962-93177

SHEET

DSCC FORM 2234

APR 97

3.2.5 Timing waveforms. The switching test circuit and waveforms shall be as specified on figure 4.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over

the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The

electrical tests for each subgroup are defined in table I. Unless otherwise specified, the values specified in table I are the

preirradiation and postirradiation values. Postirradiation electrical measurements for any RHA level are tested at, T

+25°C.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also

be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to

space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this

option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-

PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as

required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,

appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a

QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class

M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply

in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved

source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the

requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and

herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535

or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this

drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see

6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535 appendix A.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity

retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation

shall be made available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 105 (see MIL-PRF-38535, appendix A).

4. QUALITY ASSURANCE PROVISIONS

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance

with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the

QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection

procedures shall be in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be

conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening

shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality

conformance inspection.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

SIZE

REVISION LEVEL

5962-93177

SHEET

DSCC FORM 2234

APR 97

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