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AS7C3256K32Z-3.8BC

Description
ZBT SRAM, 256KX32, 3.8ns, CMOS, PBGA119
Categorystorage    storage   
File Size622KB,9 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
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AS7C3256K32Z-3.8BC Overview

ZBT SRAM, 256KX32, 3.8ns, CMOS, PBGA119

AS7C3256K32Z-3.8BC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
package instructionBGA, BGA119(UNSPEC)
Reach Compliance Codeunknown
Maximum access time3.8 ns
I/O typeCOMMON
JESD-609 codee0
memory density8388608 bit
Memory IC TypeZBT SRAM
memory width32
Number of terminals119
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119(UNSPEC)
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum standby current0.005 A
Minimum standby current3 V
Maximum slew rate0.325 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal locationBOTTOM
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

AS7C3256K32Z-3.8BC Related Products

AS7C3256K32Z-3.8BC AS7C3256K32Z-3.8TQC AS7C3256K36Z-3.8BC AS7C3256K36Z-3.8TQC
Description ZBT SRAM, 256KX32, 3.8ns, CMOS, PBGA119 ZBT SRAM, 256KX32, 3.8ns, CMOS, PQFP100 ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA119 ZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
package instruction BGA, BGA119(UNSPEC) QFP, QFP100,.63X.87 BGA, BGA119(UNSPEC) QFP, QFP100,.63X.87
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 3.8 ns 3.8 ns 3.8 ns 3.8 ns
I/O type COMMON COMMON COMMON COMMON
JESD-609 code e0 e0 e0 e0
memory density 8388608 bit 8388608 bit 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 32 32 36 36
Number of terminals 119 100 119 100
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 256KX32 256KX32 256KX36 256KX36
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA QFP BGA QFP
Encapsulate equivalent code BGA119(UNSPEC) QFP100,.63X.87 BGA119(UNSPEC) QFP100,.63X.87
Package form GRID ARRAY FLATPACK GRID ARRAY FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.005 A 0.005 A 0.005 A 0.005 A
Minimum standby current 3 V 3 V 3 V 3 V
Maximum slew rate 0.325 mA 0.325 mA 0.325 mA 0.325 mA
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING BALL GULL WING
Terminal location BOTTOM QUAD BOTTOM QUAD
Base Number Matches 1 1 1 1
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