AS7C3256K36Z-3.8TQC datasheet, PDF

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AS7C3256K36Z-3.8TQC: DescriptionZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100; Categorystorage storage; File Size622KB，9 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C3256K36Z-3.8TQC Overview

ZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100

AS7C3256K36Z-3.8TQC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
package instruction	QFP, QFP100,.63X.87
Reach Compliance Code	unknown
Maximum access time	3.8 ns
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	36
Number of terminals	100
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum standby current	0.005 A
Minimum standby current	3 V
Maximum slew rate	0.325 mA
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	QUAD
Base Number Matches	1

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AS7C3256K36Z-3.8TQC Related Products

	AS7C3256K36Z-3.8TQC	AS7C3256K32Z-3.8BC	AS7C3256K32Z-3.8TQC	AS7C3256K36Z-3.8BC
Description	ZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100	ZBT SRAM, 256KX32, 3.8ns, CMOS, PBGA119	ZBT SRAM, 256KX32, 3.8ns, CMOS, PQFP100	ZBT SRAM, 256KX36, 3.8ns, CMOS, PBGA119
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
package instruction	QFP, QFP100,.63X.87	BGA, BGA119(UNSPEC)	QFP, QFP100,.63X.87	BGA, BGA119(UNSPEC)
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	3.8 ns	3.8 ns	3.8 ns	3.8 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-609 code	e0	e0	e0	e0
memory density	9437184 bit	8388608 bit	8388608 bit	9437184 bit
Memory IC Type	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	36	32	32	36
Number of terminals	100	119	100	119
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	256KX36	256KX32	256KX32	256KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	BGA	QFP	BGA
Encapsulate equivalent code	QFP100,.63X.87	BGA119(UNSPEC)	QFP100,.63X.87	BGA119(UNSPEC)
Package form	FLATPACK	GRID ARRAY	FLATPACK	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A
Minimum standby current	3 V	3 V	3 V	3 V
Maximum slew rate	0.325 mA	0.325 mA	0.325 mA	0.325 mA
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	BALL	GULL WING	BALL
Terminal location	QUAD	BOTTOM	QUAD	BOTTOM
Base Number Matches	1	1	1	1

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