HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Other features | WITH DUAL OUTPUT ENABLE |
| series | HC/UH |
| JESD-30 code | R-CDIP-T20 |
| JESD-609 code | e0 |
| length | 24.515 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| propagation delay (tpd) | 38 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| MC54HC541J | MC74HC541DW | MC74HC541DWR2 | MC74HC541N | MC74HC541JG | |
|---|---|---|---|---|---|
| Description | HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, SOIC-20 | HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, SOIC-20 | HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20 | HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, LEAD FREE, CERAMIC, DIP-20 |
| Parts packaging code | DIP | SOIC | SOIC | DIP | DIP |
| package instruction | DIP, | SOP, | SOP, | DIP, | DIP, |
| Contacts | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Other features | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-CDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-CDIP-T20 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | SOP | SOP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| propagation delay (tpd) | 38 ns | 38 ns | 38 ns | 38 ns | 38 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | - |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - |
| Maker | Motorola ( NXP ) | - | - | Motorola ( NXP ) | Motorola ( NXP ) |
| JESD-609 code | e0 | e0 | e0 | e0 | - |
| length | 24.515 mm | 12.8 mm | 12.8 mm | 26.415 mm | - |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Maximum seat height | 5.08 mm | 2.65 mm | 2.65 mm | 4.57 mm | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
京公网安备 11010802033920号
EEWORLD
