1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89692
01
X
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
Generic number 1/
Circuit function
16K X 4 static ram
"
"
"
"
"
Acess time
25 ns (data retention)
25 ns
20 ns (data retention)
20 ns
15 ns (data retention)
15 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
K
X
Y
Z
Descriptive designator
GDFP2-F24 or CDFP3-F24
See figure 1
See figure 1
See figure 1
Terminals
24
22
22
22
Package style
flat package
dual-in-line package
dual-in-line package
leadless chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (V
CC
) ------------------------------------
DC output current ------------------------------------------------
Ambient storage temperature --------------------------------
Temperature under bias----------------------------------------
Thermal resistance, junction-to-case (Θ
JC
):.
Cases K----------------------------------------------------
Case X and Y ---------------------------------------------
Case Z ------------------------------------------------------
Power dissipation, (P
D
) ----------------------------------------
Lead temperature (soldering, 10 seconds) ----------------
1.4 Recommended operating conditions.
Supply voltage (V
CC
) --------------------------------------------
Ground voltage (V
SS
)--------------------------------------------
Input high voltage (V
IH
) -----------------------------------------
Input low voltage (V
IL
) ------------------------------------------
Operating case temperature range (T
C
) --------------------
1/
-0.5 V dc to +7.0 V dc
20 mA
-65°C to +150°C
-55°C to +125°C
See MIL-STD-1835
28°C/W
22°C/W
1.0 W
+260°C
2/
+4.5 V dc to +5.5 V dc 2/
0 V dc
+2.2 V dc to V
CC
+ 0.5 V dc
-0.5 V dc to 0.8 V dc 3/
-55°C to +125°C
Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103.
2/ All voltages referenced to V
SS
.
3/ V
IL
negative undershoots to a minimum of -2.0 V dc are allowed with a maximum 20 ns pulse width.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-89692
SHEET
A
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.2 Truth table. The truth table shall be as specified on figure 3.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass
the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements
as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics
are as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89692
SHEET
A
3
stm32/stm8
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EEWORLD
