5962-8969202ZX datasheet, PDF - EEWORLD Datasheet

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5962-8969202ZX: DescriptionStandard SRAM, 16KX4, 25ns, CMOS, CQCC22,; Categorystorage storage; File Size202KB，20 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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5962-8969202ZX Overview

Standard SRAM, 16KX4, 25ns, CMOS, CQCC22,

5962-8969202ZX Parametric

Parameter Name	Attribute value
Maker	TEMIC
Reach Compliance Code	unknown
Maximum access time	25 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N22
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	22
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC22,.3X.5
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.13 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Boilerplate update, part of 5 year review. ksr

DATE (YR-MO-DA)

06-10-31

APPROVED

Raymond Monnin

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth S. Rice

CHECKED BY

Charles Reusing

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

89-12-12

REVISION LEVEL

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS, 16K X 4 STATIC RAM (SRAM),

MONOLITHIC SILICON

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-89692

5962-E010-07

DSCC FORM 2233

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.2 Truth table. The truth table shall be as specified on figure 3.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.

3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection

only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass

the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor

testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements

as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics

are as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89692

SHEET

5962-8969202ZX Related Products

	5962-8969202ZX	5962-8969204ZX	5962-8969202YX
Description	Standard SRAM, 16KX4, 25ns, CMOS, CQCC22,	Standard SRAM, 16KX4, 20ns, CMOS, CQCC22,	Standard SRAM, 16KX4, 25ns, CMOS, CDIP22,
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	25 ns	20 ns	25 ns
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-CQCC-N22	R-CQCC-N22	R-GDIP-T22
memory density	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4
Number of functions	1	1	1
Number of terminals	22	22	22
word count	16384 words	16384 words	16384 words
character code	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
organize	16KX4	16KX4	16KX4
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	QCCN	DIP
Encapsulate equivalent code	LCC22,.3X.5	LCC22,.3X.5	DIP22,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum standby current	0.02 A	0.02 A	0.02 A
Minimum standby current	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.13 mA	0.13 mA	0.13 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL
Base Number Matches	1	1	1
Maker	TEMIC	-	TEMIC

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