DN6S04TTEB datasheet, PDF - EEWORLD Datasheet

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DN6S04TTEB: Description18-LINE DIODE BUS TERMINATION ARRAY, PDSO24; Categorysemiconductor Analog mixed-signal IC; File Size99KB，2 Pages; ManufacturerKOA Speer; Websitehttp://www.koaspeer.com/

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DN6S04TTEB Overview

18-LINE DIODE BUS TERMINATION ARRAY, PDSO24

DN6S04TTEB Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	24
Maximum operating temperature	155 Cel
Minimum operating temperature	-55 Cel
Processing package description	ROHS COMPLIANT, QSOP-24
Lead-free	Yes
EU RoHS regulations	Yes
China RoHS regulations	Yes
state	ACTIVE
packaging shape	Rectangle
Package Size	SMALL OUTLINE, SHRINK PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6350 mm
terminal coating	MATTE Tin
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	MILITARY
Interface Type	Diode Bus Termination Array
Number of signal lines	18

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PMS 300 neg.

Black neg.

DN(X)

features

•

Fast reverse recovery time

•

Fast turn on time

Low capacitance

•

SMD packages

16 kV IEC61000-4-2 capable

Products with lead-free terminations meet EU RoHS

and China RoHS requirements

diode terminator network

circuit

protection

applications

•

Signal termination

•

Signal conditioning

dimensions and construction

S03

Bonding

Wire

Die

Pad

Molded

Resin

Wafer

Lead

Molded

Resin

Die

Si Pad

Wafer

•

ESD suppression

•

Transient suppression

S04

Bonding

Wire

Lead

Package Total

Code Power

S03

S04

S06

N08

225mw

400mw

1000mw

Pins

Dimensions

inches

(mm)

L ±0.2 W ±0.2 p ±0.1

Pkg Ht

d ±0.05

±0.2

.115

(2.92)

.115

(2.92)

.115

(2.92)

.190

(4.83)

.341

(8.66)

.341

(8.66)

.091

(2.30)

.091

(2.30)

.110

(2.80)

.236

(5.99)

.236

(5.99)

.236

(5.99)

.075

(1.91)

.075

(1.91)

.037

(0.95)

.050

(1.27)

.025

(0.635)

.025

(0.635)

.037

(0.95)

.037

(0.95)

.037

(0.95)

.063

(1.60)

.063

(1.60)

.063

(1.60)

.017

(0.43)

.017

(0.43)

.017

(0.43)

.016

(0.41)

.010

(0.25)

.010

(0.25)

S06

N08, Q20,

Q24

Bonding

Wire

Lead

Bonding

Wire

Lead

Q20

Q24

Wafer

Molded

Resin

Die

Pad

Die

Pad

Wafer

Molded

Resin

circuit schematic

DNA:

20 pins

DN2:

20 pins

DN3:

6 pins

DN4:

4 pins

DN5:

24 pins

DN6:

8 pins

DN7:

24 pins

For further information on packaging, please refer to Appendix A.

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

11/21/08

200

KOA Speer Electronics, Inc.

• 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com

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