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DN5Q24TTE

Description
18-LINE DIODE BUS TERMINATION ARRAY, PDSO24
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size99KB,2 Pages
ManufacturerKOA Speer
Websitehttp://www.koaspeer.com/
Environmental Compliance
Related ProductsFound1parts with similar functions to DN5Q24TTE
Download Datasheet Parametric View All

DN5Q24TTE Overview

18-LINE DIODE BUS TERMINATION ARRAY, PDSO24

DN5Q24TTE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionSSOP,
Contacts24
Reach Compliance Codecompli
ECCN codeEAR99
Differential outputNO
Interface integrated circuit typeDIODE BUS TERMINATION ARRAY
JESD-30 codeR-PDSO-G24
JESD-609 codee3
length8.66 mm
Humidity sensitivity level1
Number of functions1
Number of signal lines18
Number of terminals24
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.8 mm
surface mountYES
Temperature levelMILITARY
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperature3
width5.99 mm
Base Number Matches1
PMS 300 neg.
Black neg.
DN(X)
EU
features
Fast reverse recovery time
Fast turn on time
Low capacitance
SMD packages
16 kV IEC61000-4-2 capable
Products with lead-free terminations meet EU RoHS
and China RoHS requirements
diode terminator network
circuit
protection
applications
Signal termination
Signal conditioning
dimensions and construction
S03
L
P
Bonding
Wire
Die
Pad
W
Molded
Resin
Si
Wafer
Lead
d
Molded
Resin
W
Die
Si Pad
Wafer
ESD suppression
Transient suppression
S04
L
p
Bonding
Wire
Lead
d
Package Total
Code Power
S03
S04
S06
N08
225mw
225mw
225mw
400mw
1000mw
1000mw
Pins
3
4
6
8
20
24
Dimensions
inches
(mm)
L ±0.2 W ±0.2 p ±0.1
Pkg Ht
d ±0.05
±0.2
.115
(2.92)
.115
(2.92)
.115
(2.92)
.190
(4.83)
.341
(8.66)
.341
(8.66)
.091
(2.30)
.091
(2.30)
.110
(2.80)
.236
(5.99)
.236
(5.99)
.236
(5.99)
.075
(1.91)
.075
(1.91)
.037
(0.95)
.050
(1.27)
.025
(0.635)
.025
(0.635)
.037
(0.95)
.037
(0.95)
.037
(0.95)
.063
(1.60)
.063
(1.60)
.063
(1.60)
.017
(0.43)
.017
(0.43)
.017
(0.43)
.016
(0.41)
.010
(0.25)
.010
(0.25)
S06
L
p
N08, Q20,
Q24
Bonding
Wire
Lead
L
Bonding
Wire
d
p
Lead
Q20
Q24
W
Si
Wafer
Molded
Resin
W
d
Die
Pad
Die
Pad
Si
Wafer
Molded
Resin
circuit schematic
1
1
DNA:
20 pins
DN2:
20 pins
1
DN3:
6 pins
1
DN4:
4 pins
1
DN5:
24 pins
1
DN6:
8 pins
1
DN7:
24 pins
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/21/08
200
KOA Speer Electronics, Inc.
• 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com

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