SRAM Module, 128KX32, 35ns, CMOS, CPGA66
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | PGA, PGA66,11X11 |
| Reach Compliance Code | unknown |
| Maximum access time | 35 ns |
| I/O type | COMMON |
| JESD-30 code | S-XPGA-P66 |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of terminals | 66 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX32 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA66,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum standby current | 0.2 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.45 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Base Number Matches | 1 |
| 32S128-35/BZCJC | 32S128-55/BZCJC | 32S128-85/BZCJC | |
|---|---|---|---|
| Description | SRAM Module, 128KX32, 35ns, CMOS, CPGA66 | SRAM Module, 128KX32, 55ns, CMOS, CPGA66 | SRAM Module, 128KX32, 85ns, CMOS, CPGA66 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| package instruction | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 35 ns | 55 ns | 85 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 32 | 32 | 32 |
| Number of terminals | 66 | 66 | 66 |
| word count | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 128KX32 | 128KX32 | 128KX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | PGA | PGA | PGA |
| Encapsulate equivalent code | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 |
| Package shape | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum standby current | 0.2 A | 0.2 A | 0.2 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.45 mA | 0.45 mA | 0.45 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| Base Number Matches | 1 | 1 | 1 |
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