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32S128-55/BZCJC

Description
SRAM Module, 128KX32, 55ns, CMOS, CPGA66
Categorystorage    storage   
File Size342KB,5 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

32S128-55/BZCJC Overview

SRAM Module, 128KX32, 55ns, CMOS, CPGA66

32S128-55/BZCJC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionPGA, PGA66,11X11
Reach Compliance Codeunknown
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeS-XPGA-P66
JESD-609 codee0
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum standby current0.2 A
Minimum standby current4.5 V
Maximum slew rate0.45 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Base Number Matches1

32S128-55/BZCJC Related Products

32S128-55/BZCJC 32S128-35/BZCJC 32S128-85/BZCJC
Description SRAM Module, 128KX32, 55ns, CMOS, CPGA66 SRAM Module, 128KX32, 35ns, CMOS, CPGA66 SRAM Module, 128KX32, 85ns, CMOS, CPGA66
Is it Rohs certified? incompatible incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
package instruction PGA, PGA66,11X11 PGA, PGA66,11X11 PGA, PGA66,11X11
Reach Compliance Code unknown unknown unknown
Maximum access time 55 ns 35 ns 85 ns
I/O type COMMON COMMON COMMON
JESD-30 code S-XPGA-P66 S-XPGA-P66 S-XPGA-P66
JESD-609 code e0 e0 e0
memory density 4194304 bit 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32
Number of terminals 66 66 66
word count 131072 words 131072 words 131072 words
character code 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 128KX32 128KX32 128KX32
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC
encapsulated code PGA PGA PGA
Encapsulate equivalent code PGA66,11X11 PGA66,11X11 PGA66,11X11
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum standby current 0.2 A 0.2 A 0.2 A
Minimum standby current 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.45 mA 0.45 mA 0.45 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR
Base Number Matches 1 1 1
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