74HCT2G34GW-G datasheet, PDF - EEWORLD Datasheet

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74HCT2G34GW-G: DescriptionIC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate; Categorylogic logic; File Size79KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate

74HCT2G34GW-G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SOT-363
package instruction	PLASTIC, SOT363, SC-88, 6 PIN
Contacts	6
Reach Compliance Code	unknown
series	HCT
JESD-30 code	R-PDSO-G6
JESD-609 code	e3
length	2 mm
Logic integrated circuit type	BUFFER
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	29 ns
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	1.25 mm

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74HC2G34; 74HCT2G34

Dual buffer gate

Rev. 01 — 6 October 2006

Product data sheet

1. General description

The 74HC2G34; 74HCT2G34 is a high-speed Si-gate CMOS device.

The 74HC2G34; 74HCT2G34 provides two buffers.

2. Features

Wide supply voltage range from 2.0 V to 6.0 V

Complies with JEDEC standard no. 7A

High noise immunity

ESD protection:

HBM JESD22-A114-D exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Low power dissipation

Balanced propagation delays

Unlimited input rise and fall times

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74HC2G34GW

74HC2G34GV

74HCT2G34GW

74HCT2G34GV

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

SC-88

SC-74

SC-88

SC-74

Description

plastic surface-mounted package; 6 leads

plastic surface-mounted package (TSOP6); 6 leads

plastic surface-mounted package; 6 leads

plastic surface-mounted package (TSOP6); 6 leads

Version

SOT363

SOT457

SOT363

SOT457

Type number

4. Marking

Table 2.

Marking

Marking code

P34

U34

Type number

74HC2G34GW

74HC2G34GV

74HCT2G34GW

74HCT2G34GV

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Description	IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate	buffers & line drivers dual buffer gate	buffers & line drivers dual buffer gate	IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate	Buffer, HCT Series, 2-Func, 1-Input, CMOS, PDSO6	IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate	IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	PLASTIC, SOT363, SC-88, 6 PIN	PLASTIC, SC-74, SOT-457, TSOP-6	PLASTIC, SC-74, SOT-457, TSOP-6	PLASTIC, SOT457, SC-74, TSOP-6	TSSOP,	PLASTIC, SOT457, SC-74, TSOP-6	PLASTIC, SOT363, SC-88, 6 PIN
Reach Compliance Code	unknown	compli	compli	unknown	unknown	unknown	unknown
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to
Parts packaging code	SOT-363	TSOP	TSOP	TSOP	-	TSOP	SOT-363
Contacts	6	6	6	6	-	6	6
series	HCT	-	-	HC/UH	HCT	HCT	HC/UH
JESD-30 code	R-PDSO-G6	-	-	R-PDSO-G6	R-PDSO-G6	R-PDSO-G6	R-PDSO-G6
JESD-609 code	e3	-	-	e3	-	e3	e3
length	2 mm	-	-	2.8 mm	2 mm	2.8 mm	2 mm
Logic integrated circuit type	BUFFER	-	-	BUFFER	BUFFER	BUFFER	BUFFER
Humidity sensitivity level	1	-	-	1	-	1	1
Number of functions	2	-	-	2	2	2	2
Number of entries	1	-	-	1	1	1	1
Number of terminals	6	-	-	6	6	6	6
Maximum operating temperature	125 °C	-	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	-	-	TSSOP	TSSOP	TSSOP	TSSOP
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	-	-	260	-	260	260
propagation delay (tpd)	29 ns	-	-	125 ns	29 ns	29 ns	125 ns
Certification status	Not Qualified	-	-	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	-	-	1.1 mm	1.1 mm	1.1 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	-	-	6 V	5.5 V	5.5 V	6 V
Minimum supply voltage (Vsup)	4.5 V	-	-	2 V	4.5 V	4.5 V	2 V
Nominal supply voltage (Vsup)	5 V	-	-	5 V	5 V	5 V	5 V
surface mount	YES	-	-	YES	YES	YES	YES
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	TIN	-	-	TIN	-	TIN	TIN
Terminal form	GULL WING	-	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	-	0.95 mm	0.65 mm	0.95 mm	0.65 mm
Terminal location	DUAL	-	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	-	30	-	30	30
width	1.25 mm	-	-	1.5 mm	1.25 mm	1.5 mm	1.25 mm

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