74HCT2G34GW,132 datasheet, PDF

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74HCT2G34GW,132: DescriptionBuffer, HCT Series, 2-Func, 1-Input, CMOS, PDSO6; Categorylogic logic; File Size79KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74HCT2G34GW,132 Overview

Buffer, HCT Series, 2-Func, 1-Input, CMOS, PDSO6

74HCT2G34GW,132 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	TSSOP,
Reach Compliance Code	unknown
series	HCT
JESD-30 code	R-PDSO-G6
length	2 mm
Logic integrated circuit type	BUFFER
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	29 ns
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
width	1.25 mm

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74HC2G34; 74HCT2G34

Dual buffer gate

Rev. 01 — 6 October 2006

Product data sheet

1. General description

The 74HC2G34; 74HCT2G34 is a high-speed Si-gate CMOS device.

The 74HC2G34; 74HCT2G34 provides two buffers.

2. Features

Wide supply voltage range from 2.0 V to 6.0 V

Complies with JEDEC standard no. 7A

High noise immunity

ESD protection:

HBM JESD22-A114-D exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Low power dissipation

Balanced propagation delays

Unlimited input rise and fall times

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74HC2G34GW

74HC2G34GV

74HCT2G34GW

74HCT2G34GV

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

SC-88

SC-74

SC-88

SC-74

Description

plastic surface-mounted package; 6 leads

plastic surface-mounted package (TSOP6); 6 leads

plastic surface-mounted package; 6 leads

plastic surface-mounted package (TSOP6); 6 leads

Version

SOT363

SOT457

SOT363

SOT457

Type number

4. Marking

Table 2.

Marking

Marking code

P34

U34

Type number

74HC2G34GW

74HC2G34GV

74HCT2G34GW

74HCT2G34GV

74HCT2G34GW,132 Related Products

	74HCT2G34GW,132	74HC2G34GV-Q100H	74HCT2G34GV-Q100H	74HC2G34GV-G	74HCT2G34GW-G	74HCT2G34GV-G	74HC2G34GW-G
Description	Buffer, HCT Series, 2-Func, 1-Input, CMOS, PDSO6	buffers & line drivers dual buffer gate	buffers & line drivers dual buffer gate	IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate	IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate	IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate	IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	TSSOP,	PLASTIC, SC-74, SOT-457, TSOP-6	PLASTIC, SC-74, SOT-457, TSOP-6	PLASTIC, SOT457, SC-74, TSOP-6	PLASTIC, SOT363, SC-88, 6 PIN	PLASTIC, SOT457, SC-74, TSOP-6	PLASTIC, SOT363, SC-88, 6 PIN
Reach Compliance Code	unknown	compli	compli	unknown	unknown	unknown	unknown
series	HCT	-	-	HC/UH	HCT	HCT	HC/UH
JESD-30 code	R-PDSO-G6	-	-	R-PDSO-G6	R-PDSO-G6	R-PDSO-G6	R-PDSO-G6
length	2 mm	-	-	2.8 mm	2 mm	2.8 mm	2 mm
Logic integrated circuit type	BUFFER	-	-	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	2	-	-	2	2	2	2
Number of entries	1	-	-	1	1	1	1
Number of terminals	6	-	-	6	6	6	6
Maximum operating temperature	125 °C	-	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	-	-	TSSOP	TSSOP	TSSOP	TSSOP
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	29 ns	-	-	125 ns	29 ns	29 ns	125 ns
Maximum seat height	1.1 mm	-	-	1.1 mm	1.1 mm	1.1 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	-	-	6 V	5.5 V	5.5 V	6 V
Minimum supply voltage (Vsup)	4.5 V	-	-	2 V	4.5 V	4.5 V	2 V
Nominal supply voltage (Vsup)	5 V	-	-	5 V	5 V	5 V	5 V
surface mount	YES	-	-	YES	YES	YES	YES
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	GULL WING	-	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	-	0.95 mm	0.65 mm	0.95 mm	0.65 mm
Terminal location	DUAL	-	-	DUAL	DUAL	DUAL	DUAL
width	1.25 mm	-	-	1.5 mm	1.25 mm	1.5 mm	1.25 mm
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	-	TSOP	TSOP	TSOP	SOT-363	TSOP	SOT-363
Contacts	-	6	6	6	6	6	6
JESD-609 code	-	-	-	e3	e3	e3	e3
Humidity sensitivity level	-	-	-	1	1	1	1
Peak Reflow Temperature (Celsius)	-	-	-	260	260	260	260
Certification status	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Terminal surface	-	-	-	TIN	TIN	TIN	TIN
Maximum time at peak reflow temperature	-	-	-	30	30	30	30

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