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1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
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Renesas Electronics introduces a new USB-C power solution with an innovative three-level topology.
Improve performance while reducing system size
New solution combines excel...[Details]
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As the power density of modern electronic systems continues to increase, effective thermal management has become critical to ensuring system performance, reliability, and longevity—especially in hi...[Details]
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According to the latest financial report data, thanks to its leading position in advanced technology, TSMC's profit performance in the second quarter of 2025 was extremely impressive, with net prof...[Details]
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introduction
Commercial air conditioner PCBs involve both high-voltage and low-voltage power. The power supply for commercial air conditioners often passes through the controller. This forces ...[Details]
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Recently, Orbbec issued an announcement that its application for issuing A-shares to specific objects in 2025 has been accepted by the Shanghai Stock Exchange.
The announcement shows that the ...[Details]
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Preface
A home ventilator, short for continuous positive airway pressure, is an effective treatment for sleep apnea-hypopnea syndrome. A nasal mask is worn during sleep, and the mask is connec...[Details]
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On August 14, Chinese researchers broke through the bottleneck of energy density and application performance of existing traditional lithium-ion batteries and developed soft-pack batteries with an ...[Details]
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A car's drivetrain is essentially a system that includes the engine (a traditional internal combustion engine) that powers the vehicle, transmitting that power to the transmission, drive shaft, and...[Details]
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The device is space-saving, with a footprint of only 4 mm x 4 mm, is sealed to IP67 and operates at temperatures up to +140°C.
MALVERN, Pennsylvania, USA and SHANGHAI, China – August...[Details]
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Radio frequency (RF) testing is a critical step in embedded system development and verification, particularly in industries such as telecommunications, aerospace, automotive, and the Internet...[Details]
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1. Mainstream Technologies in Fiber Optic Networks
1.1. New Fiber Optic Technologies
Fiber manufacturing technology is now largely mature and is now in mass production. Currently, singl...[Details]
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Multi-touch sensing is an extension of capacitive sensing. Capacitive sensing makes touch technology more intuitive, enabling simultaneous detection of multiple fingers and gesture recognition. Thi...[Details]
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Naxin Micro has launched the NSD7315 series of high-current H-bridge driver chips, which have a 40V withstand voltage capability and a 10A peak output current. They support both hardware and softwa...[Details]
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On August 11th, Science and Technology Daily reported on August 10th that researchers from Kunming University of Science and Technology have developed a new grain boundary stabilization technology ...[Details]