NTC thermistors for
temperature measurement
Probe assemblies
Series/Type:
Date:
B57703M
March 2013
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Temperature measurement
Probe assemblies
B57703M
M703
Applications
Surface temperature measurement,
e.g. on housings and heat sinks
Features
High accuracy
Easy mounting
Good thermal coupling through metal tag
Thermistor encapsulated in metal-tag case
AWG 30, PTFE-insulated leads of
silver-plated nickel wire or AWG 26
(stranded, 7 x AWG 34), PTFE-insulated
leads of silver-plated copper wire
UL approval (E69802)
Options
Alternative resistance ratings, rated
temperatures, resistance tolerances, lead
lengths and AWG 28 stranded wires
available on request.
Delivery mode
Bulk
Dimensional drawing
Dimensions in mm
Approx. weight 0.8 g
Ordering code
B57703M0103A017
B57703M0103A018
B57703M0103A019
B57703M0103G040
B57703M0303G040
B57703M0502G040
Wire length
"l" in mm
115
±10
200
±10
500
±10
45
±3
45
±3
45
±3
General technical data
Climatic category
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Test voltage
(IEC 60068-1)
(at 25
°C)
55/125/56
150
±2
25
approx. 3
approx. 50
approx. 150
1000
(in air)
(in air)
(t = 1 s)
P
25
∆R
R
/R
R
T
R
δ
th1)
τ
c1)
C
th1)
V
test
mW
%
°C
mW/K
s
mJ/K
V AC
1) Depends on mounting situation.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 2 of 9
Temperature measurement
Probe assemblies
B57703M
M703
Electrical specification and ordering codes
R
25
Ω
10 k
10 k
10 k
5k
10 k
30 k
No. of R/T
characteristic
8016
8016
8016
8016
8016
8018
B
25/100
K
3988
±1%
3988
±1%
3988
±1%
3988
±1%
3988
±1%
3964
±1%
Wire
length "l"
in mm
115
±10
200
±10
500
±10
45
±3
45
±3
45
±3
Wire
Ordering code
AWG 26
AWG 26
AWG 26
AWG 30
AWG 30
AWG 30
B57703M0103A017
B57703M0103A018
B57703M0103A019
B57703M0502G040
B57703M0103G040
B57703M0303G040
Note:
AWG 26 (stranded, 7 x AWG 34), PTFE-insulated wire of silver-plated copper wire.
AWG 30, PTFE-insulated wire of silver-plated nickel wire.
Reliability data
Test
Storage in
dry heat
Standard
IEC
60068-2-2
Test conditions
∆R
25
/R
25
(typical)
< 1%
1)
Remarks
No visible
damage
Storage in damp
heat, steady state
Rapid temperature
cycling
Endurance
Long-term stability
(empirical value)
Storage at upper
category temperature
T: 125
°C
t: 1000 h
IEC
Temperature of air: 40
°C
60068-2-78 Relative humidity of air: 93%
Duration: 56 days
IEC
Lower test temperature: 55
°C
60068-2-14 Upper test temperature: 125
°C
Number of cycles: 10
P
max
: 150 mW
t: 1000 h
Temperature: 70
°C
t: 10000 h
< 1%
1)
No visible
damage
No visible
damage
No visible
damage
No visible
damage
< 0.5%
1)
< 1%
1)
< 2%
1) Exept: B57703M0103A017, B57703M0103A018, B57703M0103A019
∆R
25
/R
25
(typical) < 2%
Note
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 3 of 9
Temperature measurement
Probe assemblies
B57703M
M703
R/T characteristics
R/T No.
T (°C)
55.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
100.0
105.0
110.0
115.0
120.0
125.0
130.0
135.0
140.0
145.0
150.0
155.0
8016
8018
B
25/100
= 3988 K
B
25/100
= 3964 K
R
T
/R
25
α
(%/K) R
T
/R
25
α
(%/K)
96.3
67.01
47.17
33.65
24.26
17.7
13.04
9.707
7.293
5.533
4.232
3.265
2.539
1.99
1.571
1.249
1.0000
0.8057
0.6531
0.5327
0.4369
0.3603
0.2986
0.2488
0.2083
0.1752
0.1481
0.1258
0.1072
0.09177
0.07885
0.068
0.05886
0.05112
0.04454
0.03893
0.03417
0.03009
0.02654
0.02348
0.02083
0.01853
0.01653
7.4
7.2
6.9
6.7
6.4
6.2
6.0
5.8
5.6
5.5
5.3
5.1
5.0
4.8
4.7
4.5
4.4
4.3
4.1
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.2
3.1
3.0
2.9
2.9
2.8
2.7
2.6
2.6
2.5
2.5
2.4
2.4
2.3
2.3
30.24
22.1
16.32
12.17
9.153
6.945
5.313
4.097
3.183
2.491
1.963
1.557
1.244
1.0000
0.8083
0.6572
0.5373
0.4418
0.365
0.303
0.2527
0.2118
0.1783
0.1508
0.128
0.1091
0.0933
0.08016
0.0691
0.05974
0.05183
0.04512
0.0394
0.0345
0.03032
0.02672
0.02361
0.02091
0.01857
0.016537
6.3
6.1
5.9
5.8
5.6
5.4
5.2
5.1
4.9
4.8
4.7
4.6
4.4
4.3
4.2
4.1
4.0
3.9
3.7
3.7
3.6
3.5
3.4
3.3
3.2
3.2
3.1
3.0
2.9
2.9
2.8
2.8
2.7
2.6
2.6
2.5
2.5
2.4
2.4
2.3
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 4 of 9
Temperature measurement
Probe assemblies
B57703M
M703
Cautions and warnings
See "Important notes".
Storage
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature 25
°C
... +45
°C,
relative
humidity
≤75%
annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SO
x
, Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the
polyvinyl-sealed packages.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMD components with nickel barrier termination
12 months, for SMD components with AgPd termination 6 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 5 of 9
京公网安备 11010802033920号
EEWORLD
