73K222AL-IH datasheet, PDF - EEWORLD Datasheet

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73K222AL-IH: DescriptionV.22, V.21, Bell 212A, 103 Single-Chip Modem; CategoryWireless rf/communication Telecom circuit; File Size165KB，28 Pages; ManufacturerTDK Corporation; Websitehttp://www.tdk.com

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73K222AL-IH Overview

V.22, V.21, Bell 212A, 103 Single-Chip Modem

73K222AL-IH Parametric

Parameter Name	Attribute value
Maker	TDK Corporation
Parts packaging code	QLCC
package instruction	QCCJ,
Contacts	28
Reach Compliance Code	unknown
Other features	FULL DUPLEX
data rate	1.2 Mbps
JESD-30 code	S-PQCC-J28
length	11.5062 mm
Number of functions	1
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum slew rate	12 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.5062 mm
Base Number Matches	1

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73K222AL

V.22, V.21, Bell 212A, 103

Single-Chip Modem

April 2000

DESCRIPTION

The 73K222AL is a highly integrated single-chip

modem IC which provides the functions needed to

construct a CCITT V.22, V.21 and Bell 212A

compatible modem, capable of 1200 bit/s full-duplex

operation over dial-up lines. The 73K222AL is an

enhancement of the 73K212L/AL single-chip modem

which adds V.22 and V.21 modes to the Bell 212A and

103 operation of the 73K212AL. In Bell 212A mode,

the 73K222AL provides the normal Bell 212A and 103

functions and employs a 2225 Hz answer tone. The

73K222AL in V.22 mode produces either 550 or 1800

Hz guard tone, recognizes and generates a 2100 Hz

answer tone, and allows 600 bit/s V.22 or 0

-300 bit/s

V.21 operation. The 73K222AL integrates analog,

digital, and switched-capacitor array functions on a

single substrate, offering excellent performance and a

high level of functional integration in a single 28-pin

DIP, PLCC and 44-pin TQFP configuration. The

73K222AL operates from a single +5V supply. The

73K222AL is a new version replacing the 73K222L.

The 73K222AL should be specified for all new

designs.

The 73K222AL includes the DPSK and FSK

modulator/demodulator functions, call progress and

handshake tone monitor and a tone generator capable

of tone required for European applications.

(continued)

FEATURES

•

One-chip CCITT V.22, V.21, Bell 212A and Bell

103 standard compatible modem data pump

Full-duplex operation at 0-300 bit/s (FSK) or 600

and 1200 bit/s (DPSK)

Pin and software compatible with other TDK

Semiconductor Corporation K-Series 1-chip

modems

Interfaces

directly

with

standard

microprocessors (8048, 80C51 typical)

Serial or parallel microprocessor bus for control

Serial port for data transfer

Both synchronous and asynchronous modes of

operation including V.22 extended overspeed

Call progress, carrier, precise answer tone

(2100 or 2225 Hz), and long loop detectors

DTMF, and 550 or 1800 Hz guard tone

generators

Test modes available: ALB, DL, RDL, Mark,

Space, Alternating bit patterns

Precise automatic gain control allows 45 dB

dynamic range

CMOS technology for low power consumption

using 60 mW @ 5V

Single +5 volt supply

PLCC and PDIP packages

BLOCK DIAGRAM

AD0-AD7

DATA

BUS

BUFFER

8-BIT

BUS

FOR

ALE

RESET

READ

WRITE

CONTROL

LOGIC

CONTROL

AND

STATUS

DIGITAL

PROCESSING

PSK

MODULATOR/

DEMODULATOR

FSK

MODULATOR/

DEMODULATOR

DTMF &

TONE

GENERATORS

TRANSMIT

FILTER

RECEIVE

FILTER

TXA

RXA

INT

STATUS

AND

CONTROL

LOGIC

TXD

RXD

SERIAL

PORT

FOR

DATA

TESTS:

ALB, DLB

RDLB

PATTERNS

SMART

DIALING

DETECT

FUNCTIONS

CLOCK

GENERATOR

POWER

RXCLK

TXCLK

CLK

XTL1

EXCLK

XTL2

GND

VREF

VDD

ISET

73K222AL-IH Related Products

	73K222AL-IH	73K222AL-IGT	73K222AL-IP
Description	V.22, V.21, Bell 212A, 103 Single-Chip Modem	V.22, V.21, Bell 212A, 103 Single-Chip Modem	V.22, V.21, Bell 212A, 103 Single-Chip Modem
Maker	TDK Corporation	TDK Corporation	TDK Corporation
Parts packaging code	QLCC	QFP	DIP
package instruction	QCCJ,	LQFP,	DIP,
Contacts	28	44	28
Reach Compliance Code	unknown	unknow	unknown
Other features	FULL DUPLEX	DATA RATE MIN:300BPS	FULL DUPLEX
data rate	1.2 Mbps	1.2 Mbps	1.2 Mbps
JESD-30 code	S-PQCC-J28	S-PQFP-G44	R-PDIP-T28
length	11.5062 mm	10 mm	35.941 mm
Number of functions	1	1	1
Number of terminals	28	44	28
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	LQFP	DIP
Package shape	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK, LOW PROFILE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	1.6 mm	5.588 mm
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	J BEND	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	0.8 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL
width	11.5062 mm	10 mm	15.24 mm
Maximum slew rate	12 mA	-	12 mA
Base Number Matches	1	-	1

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