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73K222AL-IGT

Description
V.22, V.21, Bell 212A, 103 Single-Chip Modem
CategoryWireless rf/communication    Telecom circuit   
File Size165KB,28 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Download Datasheet Parametric Compare View All

73K222AL-IGT Overview

V.22, V.21, Bell 212A, 103 Single-Chip Modem

73K222AL-IGT Parametric

Parameter NameAttribute value
MakerTDK Corporation
Parts packaging codeQFP
package instructionLQFP,
Contacts44
Reach Compliance Codeunknow
Other featuresDATA RATE MIN:300BPS
data rate1.2 Mbps
JESD-30 codeS-PQFP-G44
length10 mm
Number of functions1
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Certification statusNot Qualified
Maximum seat height1.6 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width10 mm
73K222AL
V.22, V.21, Bell 212A, 103
Single-Chip Modem
April 2000
DESCRIPTION
The 73K222AL is a highly integrated single-chip
modem IC which provides the functions needed to
construct a CCITT V.22, V.21 and Bell 212A
compatible modem, capable of 1200 bit/s full-duplex
operation over dial-up lines. The 73K222AL is an
enhancement of the 73K212L/AL single-chip modem
which adds V.22 and V.21 modes to the Bell 212A and
103 operation of the 73K212AL. In Bell 212A mode,
the 73K222AL provides the normal Bell 212A and 103
functions and employs a 2225 Hz answer tone. The
73K222AL in V.22 mode produces either 550 or 1800
Hz guard tone, recognizes and generates a 2100 Hz
answer tone, and allows 600 bit/s V.22 or 0
-300 bit/s
V.21 operation. The 73K222AL integrates analog,
digital, and switched-capacitor array functions on a
single substrate, offering excellent performance and a
high level of functional integration in a single 28-pin
DIP, PLCC and 44-pin TQFP configuration. The
73K222AL operates from a single +5V supply. The
73K222AL is a new version replacing the 73K222L.
The 73K222AL should be specified for all new
designs.
The 73K222AL includes the DPSK and FSK
modulator/demodulator functions, call progress and
handshake tone monitor and a tone generator capable
of tone required for European applications.
(continued)
FEATURES
One-chip CCITT V.22, V.21, Bell 212A and Bell
103 standard compatible modem data pump
Full-duplex operation at 0-300 bit/s (FSK) or 600
and 1200 bit/s (DPSK)
Pin and software compatible with other TDK
Semiconductor Corporation K-Series 1-chip
modems
Interfaces
directly
with
standard
microprocessors (8048, 80C51 typical)
Serial or parallel microprocessor bus for control
Serial port for data transfer
Both synchronous and asynchronous modes of
operation including V.22 extended overspeed
Call progress, carrier, precise answer tone
(2100 or 2225 Hz), and long loop detectors
DTMF, and 550 or 1800 Hz guard tone
generators
Test modes available: ALB, DL, RDL, Mark,
Space, Alternating bit patterns
Precise automatic gain control allows 45 dB
dynamic range
CMOS technology for low power consumption
using 60 mW @ 5V
Single +5 volt supply
PLCC and PDIP packages
BLOCK DIAGRAM
AD0-AD7
DATA
BUS
BUFFER
8-BIT
BUS
FOR
RD
WR
ALE
CS
RESET
READ
WRITE
CONTROL
LOGIC
CONTROL
AND
STATUS
DIGITAL
PROCESSING
PSK
MODULATOR/
DEMODULATOR
FSK
MODULATOR/
DEMODULATOR
DTMF &
TONE
GENERATORS
TRANSMIT
FILTER
RECEIVE
FILTER
TXA
RXA
INT
STATUS
AND
CONTROL
LOGIC
TXD
RXD
SERIAL
PORT
FOR
DATA
TESTS:
ALB, DLB
RDLB
PATTERNS
SMART
DIALING
&
DETECT
FUNCTIONS
CLOCK
GENERATOR
POWER
RXCLK
TXCLK
CLK
XTL1
EXCLK
XTL2
GND
VREF
VDD
ISET

73K222AL-IGT Related Products

73K222AL-IGT 73K222AL-IP 73K222AL-IH
Description V.22, V.21, Bell 212A, 103 Single-Chip Modem V.22, V.21, Bell 212A, 103 Single-Chip Modem V.22, V.21, Bell 212A, 103 Single-Chip Modem
Maker TDK Corporation TDK Corporation TDK Corporation
Parts packaging code QFP DIP QLCC
package instruction LQFP, DIP, QCCJ,
Contacts 44 28 28
Reach Compliance Code unknow unknown unknown
Other features DATA RATE MIN:300BPS FULL DUPLEX FULL DUPLEX
data rate 1.2 Mbps 1.2 Mbps 1.2 Mbps
JESD-30 code S-PQFP-G44 R-PDIP-T28 S-PQCC-J28
length 10 mm 35.941 mm 11.5062 mm
Number of functions 1 1 1
Number of terminals 44 28 28
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP DIP QCCJ
Package shape SQUARE RECTANGULAR SQUARE
Package form FLATPACK, LOW PROFILE IN-LINE CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 5.588 mm 4.572 mm
Nominal supply voltage 5 V 5 V 5 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Telecom integrated circuit types MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE J BEND
Terminal pitch 0.8 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL QUAD
width 10 mm 15.24 mm 11.5062 mm
Maximum slew rate - 12 mA 12 mA
Base Number Matches - 1 1

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