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SN74LVC1G66YEAR

Description
Analog Switch ICs Single Bilateral
CategoryAnalog mixed-signal IC    The signal circuit   
File Size3MB,42 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN74LVC1G66YEAR Overview

Analog Switch ICs Single Bilateral

SN74LVC1G66YEAR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA, BGA6,2X3,20
Contacts5
Reach Compliance Code_compli
Factory Lead Time1 week
Analog Integrated Circuits - Other TypesSPST
JESD-30 codeR-XBGA-B5
length1.4 mm
normal positionNO
Number of channels1
Number of functions1
Number of terminals5
Nominal off-state isolation42 dB
Maximum on-state resistance (Ron)20 Ω
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA6,2X3,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)2.3 V
surface mountYES
Maximum disconnect time6.9 ns
Maximum connection time6.5 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.9 mm

SN74LVC1G66YEAR Related Products

SN74LVC1G66YEAR SN74LVC1G66YEPR SN74LVC1G66YZAR
Description Analog Switch ICs Single Bilateral Analog Switch ICs SINGLE ANALOG SWITCH Analog Switch ICs Single Analog Switch
Is it Rohs certified? incompatible incompatible conform to
Maker Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA BGA
package instruction VFBGA, BGA6,2X3,20 VFBGA, BGA5,2X3,20 GREEN, DSBGA-5
Contacts 5 5 5
Reach Compliance Code _compli _compli compli
Factory Lead Time 1 week 1 week 1 week
Analog Integrated Circuits - Other Types SPST SPST SPST
JESD-30 code R-XBGA-B5 R-XBGA-B5 R-XBGA-B5
length 1.4 mm 1.4 mm 1.4 mm
normal position NO NO NO
Number of channels 1 1 1
Number of functions 1 1 1
Number of terminals 5 5 5
Nominal off-state isolation 42 dB 42 dB 42 dB
Maximum on-state resistance (Ron) 20 Ω 20 Ω 20 Ω
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code VFBGA VFBGA VFBGA
Encapsulate equivalent code BGA6,2X3,20 BGA5,2X3,20 BGA5,2X3,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 1.8/5 V 1.8/5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 0.5 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 2.3 V 2.3 V 2.3 V
surface mount YES YES YES
Maximum disconnect time 6.9 ns 6.9 ns 6.9 ns
Maximum connection time 6.5 ns 6.5 ns 6.5 ns
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 0.9 mm 0.9 mm 0.9 mm
switch BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE

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