82S126/BFA datasheet, PDF - EEWORLD Datasheet

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82S126/BFA: DescriptionOTP ROM, 256X4, 70ns, TTL, CDFP16,; Categorystorage storage; File Size79KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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82S126/BFA Overview

OTP ROM, 256X4, 70ns, TTL, CDFP16,

82S126/BFA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
Maximum access time	70 ns
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
memory density	1024 bit
Memory IC Type	OTP ROM
memory width	4
Number of terminals	16
word count	256 words
character code	256
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X4
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	0.125 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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82S126/BFA Related Products

	82S126/BFA	82S126/BEA	82S129/BEA	82S129/BFA
Description	OTP ROM, 256X4, 70ns, TTL, CDFP16,	OTP ROM, 256X4, 70ns, TTL, CDIP16,	OTP ROM, 256X4, 70ns, TTL, CDIP16,	OTP ROM, 256X4, 70ns, TTL, CDFP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	70 ns	70 ns	70 ns	70 ns
JESD-30 code	R-XDFP-F16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4
Number of terminals	16	16	16	16
word count	256 words	256 words	256 words	256 words
character code	256	256	256	256
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	256X4	256X4	256X4	256X4
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	DIP	DFP
Encapsulate equivalent code	FL16,.3	DIP16,.3	DIP16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	IN-LINE	FLATPACK
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum slew rate	0.125 mA	0.125 mA	0.125 mA	0.125 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	-

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