Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, PDIP28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 64 |
| rom(word) | 2048 |
| ROM programmability | MROM |
| speed | 12 MHz |
| Maximum slew rate | 20 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| S83C752-2N28 | S83C752-6F28 | S83C752-4A28 | S87C752-1F28 | S87C752-6F28 | S87C752-2F28 | S87C752-4F28 | S87C752-5F28 | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, PDIP28, | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CDIP28, | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQCC28, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP28, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP28, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP28, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP28, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC28,.5SQ | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | R-PDIP-T28 | R-XDIP-T28 | S-PQCC-J28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 85 °C | 125 °C | 70 °C | 70 °C | 125 °C | 85 °C | 70 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | - | - | -55 °C | -40 °C | - | -40 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | QCCJ | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | LDCC28,.5SQ | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| rom(word) | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| ROM programmability | MROM | MROM | MROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| speed | 12 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | 16 MHz | 16 MHz |
| Maximum slew rate | 20 mA | 20 mA | 24 mA | 20 mA | 20 mA | 20 mA | 24 mA | 24 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
京公网安备 11010802033920号
EEWORLD
