80C31BH/BYA datasheet, PDF - EEWORLD Datasheet

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80C31BH/BYA: DescriptionMicrocontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDFP52; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，35 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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80C31BH/BYA Overview

Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDFP52

80C31BH/BYA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DFP, FL52,.7
Reach Compliance Code	unknown
Is Samacsys	N
bit size	8
CPU series	8051
JESD-30 code	R-XDFP-F52
JESD-609 code	e0
Number of terminals	52
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL52,.7
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	128
rom(word)	0
Filter level	38535Q/M;38534H;883B
speed	12 MHz
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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80C31BH/BYA Related Products

	80C31BH/BYA	87C51-16/BQA/OT	87C51-16/BUA/OT	P80CL51HFB	SC80C31BAYA44	87C51/BUA/OT	MD80C31BH/B	SC80C31BAYN40	SC80C51BAYA44	SC80C51BAYN40
Description	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDFP52	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44	Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44	Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PQCC44,	Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40	Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PDIP40,	Microcontroller, 8-Bit, MROM, 8051 CPU, 33MHz, CMOS, PQCC44,	Microcontroller, 8-Bit, MROM, 8051 CPU, 33MHz, CMOS, PDIP40,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL52,.7	DIP, DIP40,.6	QCCN, LCC44,.65SQ	QFP, QFP44,.5SQ,32	QCCJ, LDCC44,.7SQ	QCCN, LCC44,.65SQ	DIP, DIP40,.6	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8	8	8	8	8	8
CPU series	8051	8051	8051	8051	8051	8051	8051	8051	8051	8051
JESD-30 code	R-XDFP-F52	R-XDIP-T40	S-XQCC-N44	S-PQFP-G44	S-PQCC-J44	S-XQCC-N44	R-XDIP-T40	R-PDIP-T40	S-PQCC-J44	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	52	40	44	44	44	44	40	40	44	40
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	85 °C	125 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DFP	DIP	QCCN	QFP	QCCJ	QCCN	DIP	DIP	QCCJ	DIP
Encapsulate equivalent code	FL52,.7	DIP40,.6	LCC44,.65SQ	QFP44,.5SQ,32	LDCC44,.7SQ	LCC44,.65SQ	DIP40,.6	DIP40,.6	LDCC44,.7SQ	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	IN-LINE	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	1.8/6 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	128	128	128	128	128	128	128	128	128	128
rom(word)	-	4096	4096	4096	-	4096	-	-	4096	4096
speed	12 MHz	16 MHz	16 MHz	16 MHz	33 MHz	12 MHz	12 MHz	33 MHz	33 MHz	33 MHz
surface mount	YES	NO	YES	YES	YES	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	NO LEAD	GULL WING	J BEND	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	0.8 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Nominal supply voltage	5 V	5 V	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V
ROM programmability	-	UVPROM	UVPROM	MROM	-	UVPROM	-	-	MROM	MROM

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