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SC80C31BAYN40

Description
Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PDIP40,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,35 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

SC80C31BAYN40 Overview

Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PDIP40,

SC80C31BAYN40 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
bit size8
CPU series8051
JESD-30 codeR-PDIP-T40
JESD-609 codee0
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
RAM (bytes)128
rom(word)0
speed33 MHz
Maximum slew rate49 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SC80C31BAYN40 Related Products

SC80C31BAYN40 87C51-16/BQA/OT 87C51-16/BUA/OT 80C31BH/BYA P80CL51HFB SC80C31BAYA44 87C51/BUA/OT MD80C31BH/B SC80C51BAYA44 SC80C51BAYN40
Description Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PDIP40, Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40 Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44 Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDFP52 Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44 Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PQCC44, Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44 Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40 Microcontroller, 8-Bit, MROM, 8051 CPU, 33MHz, CMOS, PQCC44, Microcontroller, 8-Bit, MROM, 8051 CPU, 33MHz, CMOS, PDIP40,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP40,.6 DIP, DIP40,.6 QCCN, LCC44,.65SQ DFP, FL52,.7 QFP, QFP44,.5SQ,32 QCCJ, LDCC44,.7SQ QCCN, LCC44,.65SQ DIP, DIP40,.6 QCCJ, LDCC44,.7SQ DIP, DIP40,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
bit size 8 8 8 8 8 8 8 8 8 8
CPU series 8051 8051 8051 8051 8051 8051 8051 8051 8051 8051
JESD-30 code R-PDIP-T40 R-XDIP-T40 S-XQCC-N44 R-XDFP-F52 S-PQFP-G44 S-PQCC-J44 S-XQCC-N44 R-XDIP-T40 S-PQCC-J44 R-PDIP-T40
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
Number of terminals 40 40 44 52 44 44 44 40 44 40
Maximum operating temperature 85 °C 125 °C 125 °C 125 °C 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -55 °C -55 °C -40 °C -40 °C -55 °C -55 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP QCCN DFP QFP QCCJ QCCN DIP QCCJ DIP
Encapsulate equivalent code DIP40,.6 DIP40,.6 LCC44,.65SQ FL52,.7 QFP44,.5SQ,32 LDCC44,.7SQ LCC44,.65SQ DIP40,.6 LDCC44,.7SQ DIP40,.6
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER FLATPACK FLATPACK CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 1.8/6 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 128 128 128 128 128 128 128 128 128 128
rom(word) - 4096 4096 - 4096 - 4096 - 4096 4096
speed 33 MHz 16 MHz 16 MHz 12 MHz 16 MHz 33 MHz 12 MHz 12 MHz 33 MHz 33 MHz
surface mount NO NO YES YES YES YES YES NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY MILITARY MILITARY INDUSTRIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD FLAT GULL WING J BEND NO LEAD THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 0.8 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD DUAL QUAD QUAD QUAD DUAL QUAD DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
Nominal supply voltage 5 V 5 V 5 V 5 V - 5 V 5 V 5 V 5 V 5 V
ROM programmability - UVPROM UVPROM - MROM - UVPROM - MROM MROM
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