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374424B60023G

Description
Heat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT
CategoryThermal management products    Heat resisting bracing   
File Size198KB,4 Pages
ManufacturerBoyd Corporation
Environmental Compliance
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374424B60023G Overview

Heat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT

374424B60023G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerBoyd Corporation
package instructionROHS COMPLIANT
Reach Compliance Codeunknown
Main materialALUMINUM
colorBLACK
structureFIN
fin directionOMNIDIRECT
Surface layerANODIZED
high18 mm
length27 mm
contourPIN FIN ARRAY
Heat Resistant Support Device TypeHEAT SINK
width27 mm
Base Number Matches1
How To Select a Heat Sink
Example A
Find a space saving heat sink to keep a TO-220 device below the
maximum 150°C junction temperature in natural convection. Device
will be screw mounted with an electrically conductive interface.
Example B
Find a heat sink to keep a TO-220 device below the maximum
150 °C junction temperature in forced convection at 400 ft/min.
Device must be electrically insulated and mounted with a labor
saving clip.
Given:
PD = 12 watts
R
θJC
= 2.5°C/W (from semiconductor manufacturer)
TJ max = 140°C (from semiconductor manufacturer)
TA max = 50°C
A Hi-Flow® pad works great with clip mounting and provides the
necessary electrical insulation. Thermal resistance for
Hi-Flow® at low pressure is 1.15°C/W (from page 87).
Using equation 1, solve for R
θSA
R
θSA
= 140 – 50 - (2.5 + 1.15) = 3.85°C/W
12
Many styles are available. If board space is a concern,
533202B02551G (pg 55) meets the requirements.
Air Velocity—Feet Per Minute
400
600
800
HOW TO SELECT A HEAT SINK
Given:
PD = 6 watts
R
θJC
= 3°C/W (from semiconductor manufacturer)
TJ max = 150°C (from semiconductor manufacturer)
TA max = 65°C
A Kondux
TM
pad is a good choice for electrically conductive
applications. Thermal resistance for Kondux
TM
can be determined
from the following graph.
Typical TO-220 Performance
0.60
0.50
(ºC/W)
CS
R
0.40
0.30
0.20
0.10
0.00
0
1
2
3
4
Screw Torque (in-lb)
5
6
80
60
40
20
0
0
2
4
6
Heat Dissipated—Watts
8
10
8
6
4
2
0
Using equation 1, solve for R
θSA
R
θSA
= 150 – 65 - ( 3 + 0.5) = 10.7°C/W
6
The Index by Heat Sink Style on page 8 lists space saving heat sinks.
Several models are in the 10 °C/W range. Choose the one that best
fits the application and verify thermal resistance from graph.
Part number 593202B03500G shows
a 60 °C temperature rise at 6 watts.
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
2
4
6
Heat Dissipated—Watts
8
10
200
Air Velocity—Feet Per Minute
400
600
800
1000
10
8
6
4
2
0
53320X
53330X
According to the above graph, an airflow of 400 ft/min results
in a thermal resistance of 3°C/W. This is less than the required
thermal resistance of 3.85°C/W and is therefore acceptable
under these airflow conditions.
If height is a concern, 533702B02552G would meet the
requirements and is only 1.0” tall
Hi-Flow® is a trademark of the Bergquist Company
R
θSA
= 60 = 10.0°C/W
6
Which meets the above requirement in natural convection.
10
AMERICA
EUROPE
www.aavidthermalloy.com
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
USA
Tel: +1 (603) 224-9988 email: info@aavid.com
Italy
Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom
Tel: +44 1793 401400 email: sales.uk@aavid.com
ASIA
Singapore
Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan
Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
At 2 in-lb of torque the thermal resistance
is approximately R
θCS
= 0.5°C/W
0
100
200
1000
10
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