REVISIONS
LTR
A
DESCRIPTION
Add case outline letter U. Add vendor CAGE number 60395 to
drawing. Editorial changes throughout.
Add device type 28 to drawing. Editorial changes throughout.
Add software data protect to drawing. Updated boilerplate.
Changes in accordance with NOR 5962-R409-97
Editorial correction to page 1, correction of number of pages. Figure
1 redrawn with 32 leads vs 44 leads and dimension table corrected.
ksr
DATE (YR-MO-DA)
89-08-07
APPROVED
M. A. Frye
B
C
D
E
93-01-05
97-04-06
97-08-12
04-06-04
M. A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THE DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
E
18
REV
E
19
E
20
E
21
E
1
E
22
E
2
E
23
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
E
12
E
13
E
14
SHEET
PREPARED BY
Kenneth Rice
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Charles Reusing
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS 8K X 8-BIT
EEPROM, MONOLITHIC SILICON
SIZE
CAGE CODE
88-07-01
REVISION LEVEL
E
A
SHEET
67268
1 OF
23
5962-87514
5962-E141-04
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-87514
│
│
│
Drawing number
01
│
│
│
Device type
(see 1.2.1)
X
│
│
│
Case outline
(see 1.2.2)
X
│
│
│
Lead finish per
MIL-PRF-38535
appendix A
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Generic
number
(see 6.4)
Circuit function
(8K X 8 EEPROM)
Access
time
350 ns
300 ns
250 ns
200 ns
250 ns
350 ns
300 ns
250 ns
200 ns
120 ns
90 ns
70 ns
350 ns
300 ns
250 ns
200 ns
150 ns
350 ns
300 ns
250 ns
200 ns
150 ns
350 ns
300 ns
250 ns
200 ns
250 ns
200 ns
Write
speed
10 ms
10 ms
10 ms
10 ms
10 ms
2 ms
2 ms
2 ms
2 ms
2 ms
2 ms
2 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
10 ms
10 ms
10 ms
10 ms
10 ms
200
µs
Write
mode
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte
byte
byte
byte
byte
byte
byte
byte
byte
byte
byte/page
byte/page
byte/page
byte/page
byte/page
byte
End of write
indicator
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
DATA polling
DATA polling
DATA polling
DATA polling
DATA polling
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
Endurance
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
100,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
100,000 cycles
10,000 cycles
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
U
X
Y
Z
Descriptive designator
See figure 1
GDIP1-T28 or CDIP2-T28
CQCC1-N32
CDFP4-F28
Terminals
32
28
32
28
Package style
"J" leaded cerquad package
Dual-in-line
Rectangular leadless chip carrier
Flat pack
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87514
SHEET
E
2
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) ...................................................................... -0.3 V dc to +6.25 V dc
Storage temperature range ...................................................................... -65°C to +150°C
Maximum power dissipation (P
D
).............................................................. 1.0 W
Lead temperature (soldering, 10 seconds) .............................................. +300°C
Junction temperature (T
J
) 2/.................................................................... +175°C
Thermal resistance, junction-to-case (Θ
JC
) .............................................. See MIL-STD-1835
Input voltage range (V
IL
, V
IH
) .................................................................... -0.3 V dc to +6.25 V dc
Data retention........................................................................................... 10 years (minimum)
Endurance:
Device types 01 through 04, 06 through 26, and 28 ............................. 10,000 cycles/byte (minimum)
Device types 05 and 27.......................................................................... 100,000 cycles/byte (minimum)
Chip clear voltage (V
H
) ............................................................................. 13.0 V dc
1.4 Recommended operating conditions. 1/
Supply voltage range (V
CC
) ...................................................................... +4.5 V dc to +5.5 V dc
Case operating temperature range (T
C
) ................................................... -55°C to +125°C
Input voltage, low range (V
IL
) ................................................................... -0.1 V dc to +0.8 V dc
Input voltage, high range (V
IH
) ................................................................. +2.0 V dc to V
CC
+0.3 V dc
Chip clear voltage range (V
H
)................................................................... 12 V dc to 13 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or from
the Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
1/
2/
All voltages are referenced to V
SS
(ground).
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87514
SHEET
E
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table for unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 3.
3.2.3.1 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
drawing.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics
are as specified in table I and shall apply over the full (case or ambient) operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device
class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in
compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification
mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing EEPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87514
SHEET
E
4
3.10.1 Erasure of EEPROMS. When specified, devices shall be erased in accordance with the procedures and
characteristics specified in 4.4.1. Devices shall be shipped in the erased (logic "1's) and verified state unless otherwise
specified.
3.10.2 Programmability of EEPROMS. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified in 4.4.
3.10.3 Verification of erasure or programmability of EEPROMS. When specified, devices shall be verified as either
programmed to the specified pattern or erased. As a minimum, verification shall consist of reading the device in accordance
with the procedures and characteristics specified in 4.4.2. Any bit that does not verify to be in the proper state shall constitute
a device failure, and shall be removed from the lot.
3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along
with test data.
3.13 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test
shall be done for initial characterization and after any design or process change, which may affect data retention. The
methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the
full military temperature range. The vendor's procedure shall be kept under document control and shall be made available
upon request of the acquiring or preparing activity, along with test data.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix
A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
(3) Devices shall be burned-in containing a checkerboard pattern or equivalent.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (C
I
and C
O
measurements) shall be measured only for the initial test and after process or design changes
which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested.
d. Subgroups 7 and 8 shall include verification of the truth table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87514
SHEET
E
5
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