|
BUK475-100B |
BUK475-100A |
| Description |
TRANSISTOR 12 A, 100 V, 0.1 ohm, N-CHANNEL, Si, POWER, MOSFET, PLASTIC, FULL PACK-3, FET General Purpose Power |
TRANSISTOR 14 A, 100 V, 0.08 ohm, N-CHANNEL, Si, POWER, MOSFET, PLASTIC, FULL PACK-3, FET General Purpose Power |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
NXP |
NXP |
| package instruction |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
| Contacts |
3 |
3 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| Avalanche Energy Efficiency Rating (Eas) |
100 mJ |
100 mJ |
| Shell connection |
ISOLATED |
ISOLATED |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage |
100 V |
100 V |
| Maximum drain current (Abs) (ID) |
12 A |
14 A |
| Maximum drain current (ID) |
12 A |
14 A |
| Maximum drain-source on-resistance |
0.1 Ω |
0.08 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| Maximum feedback capacitance (Crss) |
150 pF |
150 pF |
| JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
| Number of components |
1 |
1 |
| Number of terminals |
3 |
3 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
150 °C |
150 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
FLANGE MOUNT |
FLANGE MOUNT |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
| Maximum power consumption environment |
30 W |
30 W |
| Maximum power dissipation(Abs) |
30 W |
30 W |
| Maximum pulsed drain current (IDM) |
48 A |
56 A |
| Certification status |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
SINGLE |
SINGLE |
| transistor applications |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
| Maximum off time (toff) |
240 ns |
240 ns |
| Maximum opening time (tons) |
70 ns |
70 ns |