IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,SOP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | SOP, SOP14,.25 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | J-K FLIP-FLOP |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP14,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 2/6 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Trigger type | NEGATIVE EDGE |
| MC74HC113DDS | MC54HC113JDS | MC74HC113D | MC74HC113DD | MC74HC113ND | MC74HC113NS | |
|---|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,SOP,14PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,SOP,14PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,SOP,14PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,HC-CMOS,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| package instruction | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G14 | R-XDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | SOP | DIP | DIP |
| Encapsulate equivalent code | SOP14,.25 | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| surface mount | YES | NO | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Trigger type | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
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