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74HC670D

Description
4 x 4 register file; 3-state
Categorystorage    storage   
File Size75KB,9 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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4 x 4 register file; 3-state

74HC670D Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G16
Humidity sensitivity level1
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply2/6 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT670
4 x 4 register file; 3-state
Product specification
File under Integrated Circuits, IC06
December 1990

74HC670D Related Products

74HC670D 74HCT670N 74HC670 74HC670N 74HCT670 74HCT670D
Description 4 x 4 register file; 3-state 4 x 4 register file; 3-state 4 x 4 register file; 3-state 4 x 4 register file; 3-state 4 x 4 register file; 3-state 4 x 4 register file; 3-state
Is it Rohs certified? conform to conform to - conform to - conform to
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Code unknow unknow - unknow - unknow
JESD-30 code R-PDSO-G16 R-PDIP-T16 - R-PDIP-T16 - R-PDSO-G16
Number of terminals 16 16 - 16 - 16
Maximum operating temperature 125 °C 125 °C - 125 °C - 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SOP DIP - DIP - SOP
Encapsulate equivalent code SOP16,.25 DIP16,.3 - DIP16,.3 - SOP16,.25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE IN-LINE - IN-LINE - SMALL OUTLINE
power supply 2/6 V 5 V - 2/6 V - 5 V
Certification status Not Qualified Not Qualified - Not Qualified - Not Qualified
surface mount YES NO - NO - YES
technology CMOS CMOS - CMOS - CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE - AUTOMOTIVE
Terminal form GULL WING THROUGH-HOLE - THROUGH-HOLE - GULL WING
Terminal pitch 1.27 mm 2.54 mm - 2.54 mm - 1.27 mm
Terminal location DUAL DUAL - DUAL - DUAL
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