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SSTUM32865ET/G

Description
IC SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160, 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160, FF/Latch
Categorylogic    logic   
File Size141KB,28 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

SSTUM32865ET/G Overview

IC SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160, 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160, FF/Latch

SSTUM32865ET/G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instruction9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160
Contacts160
Manufacturer packaging codeSOT-802-2
Reach Compliance Codeunknown
seriesSSTU
JESD-30 codeR-PBGA-B160
length13 mm
Logic integrated circuit typeD FLIP-FLOP
Humidity sensitivity level2
Number of digits28
Number of functions1
Number of terminals160
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristicsOPEN-DRAIN
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA160,12X18,25
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply1.8 V
propagation delay (tpd)1.4 ns
Certification statusNot Qualified
Maximum seat height1.15 mm
Maximum supply voltage (Vsup)2 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
Trigger typePOSITIVE EDGE
width9 mm
minfmax450 MHz
SSTUM32865
1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800
RDIMM applications
Rev. 01 — 19 September 2007
Product data sheet
1. General description
The SSTUM32865 is a 1.8 V 28-bit 1 : 2 register specifically designed for use on two rank
by four (2R
×
4) and similar high-density Double Data Rate 2 (DDR2) memory modules. It
is similar in function to the JEDEC-standard 14-bit DDR2 register, but integrates the
functionality of the normally required two registers in a single package, thereby freeing up
board real-estate and facilitating routing to accommodate high-density Dual In-line
Memory Module (DIMM) designs.
The SSTUM32865 also integrates a parity function, which accepts a parity bit from the
memory controller, compares it with the data received on the D-inputs and indicates
whether a parity error has occurred on its open-drain PTYERR pin (active LOW).
It further offers added features over the JEDEC standard register in that it is permanently
configured for high output drive strength. This allows use in high density designs with
heavier than normal net loading conditions. Furthermore, the SSTUM32865 features two
additional chip select inputs, which allow more versatile enabling and disabling in densely
populated memory modules. Both added features (drive strength and chip selects) are
fully backward compatible to the JEDEC standard register.
The SSTUM32865 is packaged in a 160-ball, 12
×
18 grid, 0.65 mm ball pitch, thin profile
fine-pitch ball grid array (TFBGA) package, which, while requiring a minimum
9 mm
×
13 mm of board space, allows for adequate signal routing and escape using
conventional card technology.
2. Features
I
28-bit data register supporting DDR2
I
Fully compliant to JEDEC standard for SSTUB32865
I
Supports 2 rank by 4 DIMM density by integrating equivalent functionality of two
JEDEC-standard DDR2 registers (that is, 2
×
SSTUB32864 or 2
×
SSTUB32866)
I
Parity checking function across 22 input data bits
I
Parity out signal
I
Controlled multi-impedance output impedance drivers enable optimal signal integrity
and speed
I
Meets or exceeds SSTUB32865 JEDEC standard speed performance
I
Supports up to 450 MHz clock frequency of operation
I
Permanently configured for high output drive
I
Optimized pinout for high-density DDR2 module design
I
Chip-selects minimize power consumption by gating data outputs from changing state
I
Two additional chip select inputs allow optional flexible enabling and disabling

SSTUM32865ET/G Related Products

SSTUM32865ET/G SSTUM32865ET/S
Description IC SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160, 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160, FF/Latch IC SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA160, 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160, FF/Latch
Is it Rohs certified? conform to conform to
Maker NXP NXP
Parts packaging code BGA BGA
package instruction 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160 9 X 13 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, SOT-802-2, TFBGA-160
Contacts 160 160
Manufacturer packaging code SOT-802-2 SOT-802-2
Reach Compliance Code unknown unknown
series SSTU SSTU
JESD-30 code R-PBGA-B160 R-PBGA-B160
length 13 mm 13 mm
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP
Humidity sensitivity level 2 2
Number of digits 28 28
Number of functions 1 1
Number of terminals 160 160
Maximum operating temperature 70 °C 85 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN
Output polarity TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA
Encapsulate equivalent code BGA160,12X18,25 BGA160,12X18,25
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260
power supply 1.8 V 1.8 V
propagation delay (tpd) 1.4 ns 1.4 ns
Certification status Not Qualified Not Qualified
Maximum seat height 1.15 mm 1.15 mm
Maximum supply voltage (Vsup) 2 V 2 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
Temperature level COMMERCIAL OTHER
Terminal form BALL BALL
Terminal pitch 0.65 mm 0.65 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40
Trigger type POSITIVE EDGE POSITIVE EDGE
width 9 mm 9 mm
minfmax 450 MHz 450 MHz
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