SSTUM32865
1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-800
RDIMM applications
Rev. 01 — 19 September 2007
Product data sheet
1. General description
The SSTUM32865 is a 1.8 V 28-bit 1 : 2 register specifically designed for use on two rank
by four (2R
×
4) and similar high-density Double Data Rate 2 (DDR2) memory modules. It
is similar in function to the JEDEC-standard 14-bit DDR2 register, but integrates the
functionality of the normally required two registers in a single package, thereby freeing up
board real-estate and facilitating routing to accommodate high-density Dual In-line
Memory Module (DIMM) designs.
The SSTUM32865 also integrates a parity function, which accepts a parity bit from the
memory controller, compares it with the data received on the D-inputs and indicates
whether a parity error has occurred on its open-drain PTYERR pin (active LOW).
It further offers added features over the JEDEC standard register in that it is permanently
configured for high output drive strength. This allows use in high density designs with
heavier than normal net loading conditions. Furthermore, the SSTUM32865 features two
additional chip select inputs, which allow more versatile enabling and disabling in densely
populated memory modules. Both added features (drive strength and chip selects) are
fully backward compatible to the JEDEC standard register.
The SSTUM32865 is packaged in a 160-ball, 12
×
18 grid, 0.65 mm ball pitch, thin profile
fine-pitch ball grid array (TFBGA) package, which, while requiring a minimum
9 mm
×
13 mm of board space, allows for adequate signal routing and escape using
conventional card technology.
2. Features
I
28-bit data register supporting DDR2
I
Fully compliant to JEDEC standard for SSTUB32865
I
Supports 2 rank by 4 DIMM density by integrating equivalent functionality of two
JEDEC-standard DDR2 registers (that is, 2
×
SSTUB32864 or 2
×
SSTUB32866)
I
Parity checking function across 22 input data bits
I
Parity out signal
I
Controlled multi-impedance output impedance drivers enable optimal signal integrity
and speed
I
Meets or exceeds SSTUB32865 JEDEC standard speed performance
I
Supports up to 450 MHz clock frequency of operation
I
Permanently configured for high output drive
I
Optimized pinout for high-density DDR2 module design
I
Chip-selects minimize power consumption by gating data outputs from changing state
I
Two additional chip select inputs allow optional flexible enabling and disabling
NXP Semiconductors
SSTUM32865
1.8 V DDR2-800 registered buffer with parity
I
I
I
I
I
Supports Stub Series Terminated Logic SSTL_18 data inputs
Differential clock (CK and CK) inputs
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation (1.7 V to 2.0 V)
Available in 160-ball 9 mm
×
13 mm, 0.65 mm ball pitch TFBGA package
3. Applications
I
400 MT/s to 800 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
I
DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
4. Ordering information
Table 1.
Ordering information
Solder process
Package
Name
SSTUM32865ET/G
SSTUM32865ET/S
Description
Version
Type number
Pb-free (SnAgCu solder ball TFBGA160 plastic thin fine-pitch ball grid array package; SOT802-2
compound)
160 balls; body 9
×
13
×
0.7 mm
Pb-free (SnAgCu solder ball TFBGA160 plastic thin fine-pitch ball grid array package; SOT802-2
compound)
160 balls; body 9
×
13
×
0.7 mm
4.1 Ordering options
Table 2.
Ordering options
Topside mark
SSTUM32865ET
SSTUM32865ETS
Temperature range
T
amb
= 0
°C
to +70
°C
T
amb
= 0
°C
to +85
°C
Type number
SSTUM32865ET/G
SSTUM32865ET/S
SSTUM32865_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 September 2007
2 of 28
NXP Semiconductors
SSTUM32865
1.8 V DDR2-800 registered buffer with parity
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
VREF
D1
D3
D6
D7
D11
D18
CSGATEEN
CK
CK
RESET
D0
D17
D19
D13
DODT1
DCKE0
VREF
2
n.c.
D2
D4
D5
D8
D9
D12
D15
DCS0
DCS1
D14
D10
D16
D21
D20
DODT0
DCKE1
MCL
3
PARIN
n.c.
4
n.c.
n.c.
5
n.c.
n.c.
6
QCKE1A
QCKE1B
7
QCKE0A
QCKE0B
8
Q21A
Q21B
9
Q19A
Q19B
10
Q18A
Q18B
11
Q17B
QODT0B
QODT1B
12
Q17A
QODT0A
QODT1A
Q20A
Q16A
Q1A
Q2A
Q5A
QCS0A
QCS1A
Q6A
Q10A
Q9A
Q11A
Q15A
Q14A
Q8B
Q8A
002aac650
VDDL
VDDL
VDDL
VDDL
DCS2
GND
DCS3
GND
GND
VDDL
GND
GND
GND
GND
GND
GND
GND
GND
VDDL
GND
GND
VDDL
VDDL
VDDL
n.c.
VDDL
n.c.
VDDR
GND
GND
VDDR
VDDR
GND
VDDR
GND
VDDR
GND
VDDR
GND
GND
VDDR
VDDR
GND
VDDR
GND
VDDR
GND
VDDR
GND
GND
Q20B
Q16B
Q1B
Q2B
Q5B
QCS0B
QCS1B
Q6B
Q10B
Q9B
Q11B
Q15B
Q14B
VDDL
VDDL
VDDR
GND
VDDR
GND
MCL
MCL
PTYERR
n.c.
MCH
MCH
Q3B
Q3A
Q12B
Q12A
Q7B
Q7A
Q4B
Q4A
Q13B
Q13A
Q0B
Q0A
160-ball, 12
×
18 grid; top view.
An empty cell indicates no ball is populated at that grid point.
n.c. denotes a no-connect (ball present but not connected to the die).
MCL denotes a pin that must be connected LOW.
MCH denotes a pin that must be connected HIGH.
Fig 3. Ball mapping
SSTUM32865_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 19 September 2007
5 of 28